Monthly Archives

August 2022

Tessolve Participation in NXP Tech Day – Bangalore, Pune, Detroit, Silicon Valley

By | News/Press Releases

Tessolve kicks off the multi-city, multi-country demonstration of its TERA device, a key next Generation NXP technology (S32G274A based SMARC SoM) based on state-of-the-art Application Gateway at NXP Technology Days 2022 in Taj Westend Hotel Bangalore, on August 23, 2022.

Tessolve developed the TERA device to address cutting-edge automotive applications and Industrial gateway in association with NXP and DynamoEdge, its AI partners.

During the event, we had continued interactive visitors at the Tessolve booth throughout the day. Our Embedded team was explaining the spec and use case of the Tessolve TERA platform to our customers and visitors. The team also discussed with our customers their requirements for home automation/ Gateway.

If you missed us in Bangalore, catch us in the Automotive Hub of India, Pune on the 26th Of Aug @ Ritz Carlton, Pune. And if you are following us internationally, fret not and meet us at the upcoming NXP tech day events at Detroit and Silicon Valley San Jose, CA! Visit us and see the latest in Automotive and industrial gateway application at your nearest NXP tech day event in 2022!

Explore here to know more about NXP S32G2 SMARC SoM and Application Gateway:

DVCon India 2022 Conference

By | Events | No Comments

Join us at the DVCon India 2022 conference, scheduled on 5th to 6th September 2022, at Radisson Blu, Marathalli, Bangalore.

The DVCon India 2022 is a live, in-person conference, the 7th edition of the Design and Verification Conference in India planned as the first live event in the VLSI ecosystem in India.

Tessolve is partnering as the platinum sponsor at the upcoming DVCon India 2022 conference. During this world-class technical conference, we would be looking forward to connecting with the folks from different Systems, Automotive and Technology unicorns, IC companies, and start-ups to discuss innovative designs and chip architectures.

More Details
DVCon India 2022 Conference
Booth Number: 4A & 4B
5th to 6th September 2022
Radisson Blu, Marathalli, Bangalore

Five Reasons to Use System on Modules (SoM) in Embedded System Design

By | Blogs, Thought leadership | No Comments

Time is money, and it must never be wasted. This aphorism applies to everything, including embedded system technology. For this reason, System-on-Modules are so popular right now since they provide all the capabilities you need without requiring you to design, locate, and assemble the components yourself. If this is something new for you, don’t worry. At Tessolve, our team of embedded system development experts are here to help you with the essential guide to understanding SoMs.

What is a System on Modules?

Before delving into any other details, let’s start from the beginning. A module system comprises a small package with all the significant elements of an integrated processing system. This includes everything from processor cores, communication configurations, and memory blocks on a small, production-ready Printed Circuit Board (PCB). A System on Modules is a complete CPU architecture in one tiny container. This approach allows SoM to be embedded in end systems ranging from complicated robots to simple home security cameras.

However, a System on Module should not be confused with a System on a Chip (SoC). An SoC includes a series of crucial compute components, all assembled on one chip. On the contrary, an SoM is based on a board and can include multiple components, and an SoC can be one of these. So, one should keep this in mind while choosing what to incorporate into their technologies.

Blade servers initially led to the development of the system on modules. These small servers were developed to conserve energy use and save storage space. The SOM assembly has been designed in the same sleek style as blade servers, and only the elements necessary for operation are all together in one tiny package. However, this does not prevent them from being used in multiple applications, most of which we will discuss in a moment.

Tessolve provides an extremely integrated software and hardware platform developed for quick advancement and marketing time, along with an assortment of resources and tools for ease of maintenance and scalability of design.

Five Reasons to Use System on Modules (SoM) in Embedded System Design

Now that you understand what system on modules is, let’s start discussing why they must be used in embedded systems:

1. Saves time

The primary reason behind the usage of the system on modules for the embedded device is the time-saving aspect. It takes far less time to build a product based on an SoM than to design a complete system from the start. Creating the CPU infrastructure often takes the most effort when it comes to embedded systems. Instead, one can take advantage of an SoM to save time and effort that could be better spent anywhere else. Tessolve provides the best in class, reliable and secure, embedded SOM solution with integrated wireless connectivity.

2. Customization

System on Modules provides a wide range of features and processor speeds in the same packages. This allows businesses to provide the same carrier board with variable speeds. Customers can easily design custom carrier boards that meet all their requirements without individually thinking about the processor and memory. The issue related to complicated custom cables is also eliminated since most businesses will provide pre-wired connectors that match standard cables. With the help of simple process upgrades and downgrades, anyone can create their dream system without spending their entire budget and a lot of time.

3. Simplicity

Another significant reason is the advancement of semiconductor technologies. Designing an embedded system using a SoC or FPGA requires a significant amount of time and care. Since semiconductors are becoming more and more advanced, there is a lot of information and little nuances to consider during the design process. Instead, one can use an SoM and spend the rest of the time focusing on the personality of your product and taking advantage of the complexity.

4. Development cost

A system on module significantly reduces the development cost of developing an embedded system. As we mentioned at the beginning of the article, time is money, and by spending much less time on development work, most of the engineering expense is minimized.

5. Risk at the end of its useful life

The complications related to the end-of-life product based on a flash chipset or an end-of-life CPU are minimized by using a system of modules. The system may be brought back to life with a simple switch without significant carrier board changes. In addition, customers won’t have to worry about spending a lot of money on boards every year since most SoMs have a lifespan of more than five years.

You can obtain reliable SoMs from Tessolve as we also provide evaluation boards for SoM. Tessolve allows faster time to market for customers by offering a seamless shift from development to production and more.

Software and hardware development

Systems on modules can help achieve edge computing and local data processing without latency. This eliminates the requirement for expert hardware knowledge and experience by providing an intuitive design that anyone can apply. In addition, software developers who interfere with vision applications will appreciate the easily configurable sensors provided by SOMs.

Any hardware developer knows that production needs to be completed as quickly as possible, so limited resources should be focused on the highest-impact tasks. A system on modules provides field-programmable gate array (FPGA) performance and flexibility without all the hassle of PCB design and integration. With a powerful and innovative industrial System-on-Modules, integrated security, sophisticated device management tools and systems software, Tessolve’s embedded solutions minimize the expense of ownership and aid propel OEMs to success in the market.

Security cameras

One of the most common applications of SoMs is security cameras. Many system-on-modules provide 4K vision and video processing capabilities, which makes them ideal for such types of applications. These security cameras not only record videos but also use machine learning to categorize and analyze what they see, consistently delivering accurate real-time data.

Wrapping Up

System-on-Modules are the future of embedded systems development. Some of the examples listed above are just a few of hundreds of applications. Especially during the pandemic, home automation is high on people’s priority list, and most of these embedded devices are made with SoM.

Tessolve has its independent SOM Module Family, MAGIK-2 models, depending on the SMARC/Q7 standard, consisting of an entire software suite involving Device Drivers, assistance for different operating systems permitting efficient productization. SoM by Tessolve supports standard Android SDK that can be personalized for product development needs. Our System-on-Modules solutions and services permit customers to initiate their software development before manufacturing and assists in quick marketing.

Head over to Tessolve and check out our SoMs to start building your dream system today! For better assistance from our experienced engineers, email us today

PCB Stackup Design

By | Blogs, Thought leadership | No Comments

As the name implies, stackup refers to the process of collection of copper and insulation layers that form the PCB before finalizing the board design. With the advent of modern technologies, compact electronics are more than a necessity, and therefore PCB layer stacking is crucial in electronics. For compact design for electronics products, designers believe it is necessary to mount PCBs with multi-layer designs and a 3D appearance. Multilayer hardware design helps to: improve the PCB board’s ability to distribute energy properly, eliminate electromagnetic interference, minimize cross-interference, and support signals at high speeds.

Stackup technologies

With the advent of precision manufacturing, Engineers have options to choose a stackup technology suitable to their requirements. The following factors are considered for a good stackup design: the number of layers, the frequency of the circuit, the Signal and Power Integrity specs and Emission requirements. Different stackup options arise by using combinations of Plated thru vias, Blind & Buried vias and Micro (HDI) vias. Most used stackup technologies are Standard stacking with Plated Thru vias and HDI.

Standard stacking connects Multiple copper layers by Plated Thru vias. The advantage of Standard stacking is it’s straightforward and easier to design and manufacture. The fab yield is more compared to any other stackup technology. Although, designing a dense board with smaller ICs is impossible with Standard stacking.

HDI (High Density Interconnect) stackup, as the name suggests, is best suited for High-Density boards. In a smartphone or tablet, the area is compact, but the PCB must accommodate a lot of circuits in it. HDI stackups are sequentially laminated, multi-layer structures, which help to build such compact boards with components packed on both sides. The laser drilled Micro vias, that connect the layers, are smaller compared to mechanically drilled vias thus helping the compact design. Compared to standard stacking, HDI stacks will consume lesser layers and provide better electrical performance.

Blind vias start from the external layer and end in any internal layer. Buried vias, as the name suggests, start from an inner layer and end in another inner layer. These vias are used when the via stub must be limited or eliminated. Also, they are used when the drill aspect ratio must be lower. The disadvantage is having a greater number of blind vias adds up lamination cycles resulting in higher cost, longer fab lead time, and increased plating thickness on the external layer.

Rules for Proper PCB Stackup Design

Like any other design or product manufacturing, designers need to follow some rules to produce the highest quality products. As you already know, electronics go through several processes which involve different components before producing the final product. Therefore, designers must ensure they identify and follow proven design PCB stack-up best practices. For PCB stack-up design, some rules should be followed to get the best results.

  1. The first and foremost rule is the use of ground planes. They are the best choice due to their ability to route signals in strip lines. In addition, it also plays a vital role in reducing ground noise. Ground noise gets significantly reduced because of the reduced ground impedance.
  2. When it comes to high-speed signals, they must be routed to an intermediate layer that sits between different levels. In this manner, the ground plane acts as a shield and suppresses the radiation emanating from the orbit at maximum speed.
  3. Signal layers must be close to the plane.
  4. Mass planes and power should be carefully connected.
  5. It is necessary to ensure that the configuration is symmetrical.
  6. Signal impedance requirements are met.
  7. It is necessary to consider the thickness of each signal layer.
  8. Moreover, it is also essential to consider the properties of the desired material. Also, pay special attention to such materials’ thermal, electrical, chemical and mechanical properties.

Great PCB hardware design means a great deal. Businesses must have quality products and results. As you already know, circuits today operate at extremely high operating speeds, making it extremely necessary to optimize your PCB design. Comprehensive PCB design needs to make this craft an art. The reason for this is that you can have a good design or a bad design. However, a poorly designed product can seriously degrade or affect the performance of an electronic product. Some of the effects of poor PCB design include poor signal submission, low-quality power output, and reduced durability of electronics. To avoid such occurrences, it is recommended to ensure that the PCB is of high-quality design.


PCB stack-up design is essential for both designers and electronic engineers. The ability to come up with high-quality electronics requires several considerations. Without a high-quality PCB design, the product’s quality and performance can be significantly affected. Therefore, designers must ensure the right stackup construction and PCB materials are selected to obtain a high-quality product. A high-quality PCB stack-up goes a long way in getting the highest quality PCB yield and productivity.

Stackups designed for High-speed designs are costlier than those used for non-high-speed applications. Compensating the stackup quality for cost can result in poor signal integrity which makes the PCB unsuitable for High-speed application.

Usually, designers use standard and HDI stack-ups while designing PCB stack-ups since both provide unique features and benefits that appeal to designers and engineers. Businesses can select the most suitable one based on the design and performance they expect from the PCB.

Tessolve PCB team has rich experience in designing complex Stackups. Be it high layer count (60+), Multi-laminate or HDI stackups, Tessolve can support designing a manufacturable, cost-efficient stackup that still meets all the Electrical requirements.

Tessolve works closely with Fabrication shops to create the right stackup at the design stage and run DFM checks in-house which allows us to achieve an incredibly high first-pass acceptance rate and eliminates delays getting designs onto the production floor.

For better assistance from our experienced engineers, email us today