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Tessolve and NXP

Delivering High-Quality Semiconductor Design and Engineering Services

Partnership Overview

About the program and our offerings

About Connect Partner Program

NXP’s Connect Partner Program is a global network of independent engineering solution companies to speed up Client’s design.

What We Are Offering

As an NXP program partner, we offer product engineering services & solutions including design, development, regulatory qualifications, manufacturing, and post-manufacturing product life cycle support.

Our Differentiator

In-house developed a family of systems on modules “MAGIK-2” based on SMARC & Q7 standard using I.MX6 and I.MX8 processor offering Linux & Android software SDK, backed with our own EVK boards which help customers accelerate the product development cycle.

Focus On Hardware

Embedded board solutions for the NXP Program



i.MX8M SMARC SOM Using the SMARC standard 2.0 for embedded modules, supporting Linux & Android SDK with BSP.


i.MX6 SOM Boards

i.MX6 SMARC & Q7 SOM boards supporting Linux & Android SDK with BSP, Middleware & UI (Qt/Android) support.



Tessolve introduces a SMARC 2.1 SoM (System-on-Module) based on S32G2 CPU a high-performance vehicle network processor.

More On The Modules Here

Download Datasheets

Bring Your Ideas As We Enable Their Realization And Your Leadership

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