Tessolve Showcases Advanced Product Engineering at the SemiconIndia 2022 Conference.

By | News/Press Releases

Tessolve participated at the SemiconIndia 2022, the post-COVID gigantic conference in the Semiconductor industry. The Hon’ble Prime Minister of India, Shri Narendra Modi, inaugurated the conference via Video Conference on 29th April 2022 to make India a global hub for Semiconductor Design, Manufacturing, and Technology Development.

At the event booth, Tessolve highlighted the story of defining engineering success end to end through Design Test & Production. In meaningful conversations, the embedded team participating at the event demonstrated Tessolve’s Product Engineering service and IoT offerings on Industrial, Connected Cars, Smart Lighting, IoT Bricks-Sensors, Connectivity Modules, and Gateway. Our engineering team has displayed our Load boards and the various embedded products interestingly with appropriate brochures. We had visitors from Startups, Academia, and Global Industry Leaders to learn more about Tessolve, our services portfolio, and our role in the latest technologies.

Tessolve Strengthens Its Leadership Team With the Appointment of Huzefa Cutlerywala as SVP of Sales and Marketing and Madhav Rao as SVP VLSI Design

By | News/Press Releases

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and system companies, is pleased to announce the appointment of two industry veterans, Huzefa Cutlerywala as Senior VP of Worldwide Sales and Marketing, and Madhav Rao as Senior VP VLSI Design.

Read the full PR article here:

Tessolve inaugurates the Test Engineering Lab in the heart of Silicon Valley San Jose on Mar 23, 2022

By | News/Press Releases

Tessolve announces its inaugural run of its Test Engineering Lab in San Jose on Mar 23. We offer access to test engineering and program development experts and access to testers. Our lab will be designed and equipped with test instruments:

  • Advantest, 93k Smartscale STH, and CTH configurations
  • Advantest, 93k Exascale CX
  • Teradyne, ETS 364
  • Chroma, MPVI
  • Semic, Opus 3 Tri Temp Prober
  • Seiko Epson Handler
  • Chroma Handler
  • Thermostream
  • and standard diagnostics equipment

First Bin – A Newsletter for the Semiconductor Engineering Community, Issue Jan 2022

By | News/Press Releases

We are glad to announce the release of the Jan 22 edition of our Newsletter, First Bin.

The newsletter contains a note from our CEO’s Desk, Tessolve Showcase article, and Tessolve Challenge Case Study. Thanks to all the contributing authors and the technical committee members.

To know more, please download the Newsletter:

Tessolve collaborates with DynamoEdge to introduce innovative TERA

By | News/Press Releases

Tessolve’s and DynamoEdge have announced a partnership to deliver the fastest end-to-end mobility solutions powered by AT&T 5G. The strategic collaboration of Tessolve with DynamoEdge has paved the way to deploy Real-Time AI analytics software ( on our Automotive Service Gateway platform (TERA).

Read the full PR article here:

Download the brochure for NXP S32G2 SMARC SoM

Tessolve Datasheet NXPS32G2