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Tessolve, in collaboration with NXP Semiconductors, has announced the advancement of a mass-market digital connected cluster reference design, leveraging NXP’s i.MX RT1170 crossover MCU and other key components. This collaboration aims to offer OEMs a sophisticated yet easily integrate solution for digital clusters in vehicles, significantly reducing complexity and time-to-market.

The Tessolve-NXP digital cluster solution, tailored for the 2-wheeler and 3-wheeler market, features automotive compliance, high-resolution displays, advanced connectivity options, and efficient power management, providing a production-ready solution for OEMs seeking to enhance their vehicles’ digital capabilities.

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