Join us at the Japan IT Week Spring 2023 event, which will take place from April 5th to 7th at Tokyo Big Sight in Japan. Tessolve is participating in Embedded & Edge Computing Expo in hope to reach out to 100s of potential customers who would like to design and build their products using Tessolve Product Engineering Services.
Join us at Embedded World 2023 conference scheduled on 14th to 16th March 2023 at Nuremberg, Germany.
Tessolve is exhibiting a booth at the conference with Embedded demo items and showcasing data on Embedded and Automotive Embedded expertise.
Booth Hall – 3A
Booth Number – 3A-301
14th to 16th March 2023
Join us at VLSID 2023 conference scheduled on 8th to 12th Jan 2023 at Novotel, HICC, Hyderabad
Tessolve is partnering as a Bronze sponsor at the upcoming VLSID conference
Booth Number – B block 51&52
8th to 12th Jan 2023
Novotel, HICC, Hyderabad
We participated in Semicon Europa from 15th – 18th November 2022
This event is co-located with electronica in Munich, Germany, creating the strongest single event for electronics manufacturing in Europe and broadening the range of attendees across the electronic chain.
Visitors experienced our silicon and system engineering solutions for focused industries like Automotive, Datacenter/Enterprise, Industrial/IoT, Mil/Aero, and Wireless.
Electronica was held in Munich, Germany, from 15th-18th November 2022
Tessolve’s new embedded modules & AI/5G Gateway solutions were showcased world’s leading trade fair and conference for electronics.