Category

News/Press Releases

Tessolve strengthened its work in the field of Near Field Communication (NFC) based on hybrid technology

By | News/Press Releases

Tessolve strengthened its work in the field of Near Field Communication (NFC) based on hybrid technology work as the industry transitioned into the new technological world by adding automation process assistance for NFC tags, barcode scanning, and QR Code scan testing for OEMs/Device Vendors. The user-friendly functionality integrated with widely accessible hardware, such as a 3D printer, and cutting-edge cyber technology employing Python, ADB, Ui Automator, and G Code tools offer the highest efficiency. Testing speed, iteration count, and performance are improved by atomizing the NFC tag scanning test. This technology’s functions are limitless and can be used for multiple applications for various devices. Mobile phones, tablets, and enterprise mobility devices benefited from this stress testing solution for considerable cost savings and increased productivity.

Tessolve Participation in NXP Tech Day – Bangalore, Pune, Detroit, Silicon Valley

By | News/Press Releases

Tessolve kicks off the multi-city, multi-country demonstration of its TERA device, a key next Generation NXP technology (S32G274A based SMARC SoM) based on state-of-the-art Application Gateway at NXP Technology Days 2022 in Taj Westend Hotel Bangalore, on August 23, 2022.

Tessolve developed the TERA device to address cutting-edge automotive applications and Industrial gateway in association with NXP and DynamoEdge, its AI partners.

During the event, we had continued interactive visitors at the Tessolve booth throughout the day. Our Embedded team was explaining the spec and use case of the Tessolve TERA platform to our customers and visitors. The team also discussed with our customers their requirements for home automation/ Gateway.

If you missed us in Bangalore, catch us in the Automotive Hub of India, Pune on the 26th Of Aug @ Ritz Carlton, Pune. And if you are following us internationally, fret not and meet us at the upcoming NXP tech day events at Detroit and Silicon Valley San Jose, CA! Visit us and see the latest in Automotive and industrial gateway application at your nearest NXP tech day event in 2022!

Explore here to know more about NXP S32G2 SMARC SoM and Application Gateway:

https://www.tessolve.com/wp-content/uploads/2022/01/Tessolve_Datasheet_NXPS32G2.pdf

Tessolve showcased state-of-the-art Test Engineering Practices and more; Participated as a gold sponsor at the ITC India 2022 conference

By | News/Press Releases

Tessolve, a leading semiconductor engineering service partner, was an integral part of the ITC Test Week India 2022, at Radisson Blue Hotel, Bengaluru between July 24-26.

The booth highlighted the innovative test engineering solutions, our Future ready infrastructures & Labs, and glimpses of our wholesome working environment. During the two-day conference, the team exhibited product demos of the various test Load boards, system design, and embedded engineering modules. We had a compelling booth with continued visitors and key stakeholders from different companies, faculties, and students from colleges/universities to know more about Tessolve.

Apart from the booth, our engineering & leadership team has attended the interesting sessions of Tutorial and Conference. Mr. Rajesh Vaddempudi, VP of Test engineering Tessolve, was one of the panel members, who shared his experiences on the topic “Talent Development in Test/Validation Domains”. Altogether, the team was excited to participate in the International Test Conference for three enlightening days.

Tessolve Showcases Advanced Product Engineering at the SemiconIndia 2022 Conference.

By | News/Press Releases

Tessolve participated at the SemiconIndia 2022, the post-COVID gigantic conference in the Semiconductor industry. The Hon’ble Prime Minister of India, Shri Narendra Modi, inaugurated the conference via Video Conference on 29th April 2022 to make India a global hub for Semiconductor Design, Manufacturing, and Technology Development.

At the event booth, Tessolve highlighted the story of defining engineering success end to end through Design Test & Production. In meaningful conversations, the embedded team participating at the event demonstrated Tessolve’s Product Engineering service and IoT offerings on Industrial, Connected Cars, Smart Lighting, IoT Bricks-Sensors, Connectivity Modules, and Gateway. Our engineering team has displayed our Load boards and the various embedded products interestingly with appropriate brochures. We had visitors from Startups, Academia, and Global Industry Leaders to learn more about Tessolve, our services portfolio, and our role in the latest technologies.

Tessolve Strengthens Its Leadership Team With the Appointment of Huzefa Cutlerywala as SVP of Sales and Marketing and Madhav Rao as SVP VLSI Design

By | News/Press Releases

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and system companies, is pleased to announce the appointment of two industry veterans, Huzefa Cutlerywala as Senior VP of Worldwide Sales and Marketing, and Madhav Rao as Senior VP VLSI Design.

Read the full PR article here:

https://www.businesswire.com/news/home/20220413005466/en/Tessolve-Strengthens-Its-Leadership-Team-With-the-Appointment-of-Huzefa-Cutlerywala-as-SVP-of-Sales-and-Marketing-and-Madhav-Rao-as-SVP-VLSI-Design

Tessolve inaugurates the Test Engineering Lab in the heart of Silicon Valley San Jose on Mar 23, 2022

By | News/Press Releases

Tessolve announces its inaugural run of its Test Engineering Lab in San Jose on Mar 23. We offer access to test engineering and program development experts and access to testers. Our lab will be designed and equipped with test instruments:

  • Advantest, 93k Smartscale STH, and CTH configurations
  • Advantest, 93k Exascale CX
  • Teradyne, ETS 364
  • Chroma, MPVI
  • Semic, Opus 3 Tri Temp Prober
  • Seiko Epson Handler
  • Chroma Handler
  • Thermostream
  • and standard diagnostics equipment

First Bin – A Newsletter for the Semiconductor Engineering Community, Issue Jan 2022

By | News/Press Releases

We are glad to announce the release of the Jan 22 edition of our Newsletter, First Bin.

The newsletter contains a note from our CEO’s Desk, Tessolve Showcase article, and Tessolve Challenge Case Study. Thanks to all the contributing authors and the technical committee members.

To know more, please download the Newsletter:

https://www.tessolve.com/wp-content/uploads/2022/02/Tessolve_FIRST-BIN_A.pdf

Tessolve collaborates with DynamoEdge to introduce innovative TERA drA.I.ve

By | News/Press Releases

Tessolve’s and DynamoEdge have announced a partnership to deliver the fastest end-to-end mobility solutions powered by AT&T 5G. The strategic collaboration of Tessolve with DynamoEdge has paved the way to deploy Real-Time AI analytics software (drA.I.ve) on our Automotive Service Gateway platform (TERA).

Read the full PR article here:

https://www.business-standard.com/content/press-releases-ani/tessolve-and-dynamoedge-introduce-tera-dra-i-ve-122021501039_1.html

Download the brochure for NXP S32G2 SMARC SoM

Tessolve Datasheet NXPS32G2

Tessolve is now a Worldwide PDH (Preferred Design House) Partner of Infineon to provide Customer technical support and HW/SW design services on Infineon solutions portfolios such as AURIX™ Microcontrollers and related topics.

By | News/Press Releases

The partnership will allow showcasing our end-to-end capabilities in supporting Industrial and Automotive OEM’s safety-related Hardware modules, associated Software technology, innovative Automotive product development, and system validation for various customers across the globe. This strategic association will enable Infineon through Tessolve to provide 24-hrs response time to the customer by email and/or phone to AURIX™, Traveo II™, AUTO PSoC-related inquiries.

Moreover, Tessolve’s expertise & Infineon product synergy will extend technical help and advice on the Infineon solutions, Tessolve supports HW/SW Engineering to achieve optimal and effective performances and paves a way to explore new avenues for the design of ADAS / Radar / Motor Control / Lighting system. Check out the link to know more about this partnership.

Tessolve – Infineon Technologies

Tessolve Joins GlobalFoundries’ Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development

By | News/Press Releases

Tessolve has joined the GlobalFoundries® (GF®) Design Enablement Network Program. The strategic partnership with GF aims to bring state-of-the-art design solutions across multiple end markets including automotive, industrial, server, graphics, and mobile platforms. Read the full PR article here:

https://www.businesswire.com/news/home/20211103005510/en/Tessolve-Joins-GlobalFoundries%E2%80%99-Design-Enablement-Network-Program-as-a-Design-Partner-to-Bring-Advanced-Design-Solutions-to-Accelerate-Customer-Product-Development

Tessolve is recognized and featured by SiliconIndia among The 10 Best Electronics Companies to Work For in Bangalore 2021.

By | News/Press Releases

We are thrilled to share another milestone to Tessolve’s journey with the recognition Tessolve has achieved by SiliconIndia among The 10 Best Electronics Companies to Work For in Bangalore 2021.

Explore here to know more about this prestigious recognition and see Tessolve featuring in the listing on SiliconIndia’s website. Click here to view the article featuring Tessolve, honorable CEO Srini Chinamilli has shed some insight about Tessolve creating & sustaining a winning workplace culture and how our company has earned excellent credibility in the Semiconductor engineering space.

Tessolve joins the Arm approved Design partner program to accelerate time to market for product development

By | News/Press Releases

Tessolve is now a member of the Arm® Approved Design Partner program, a global network of product design service companies endorsed by Arm.
Tessolve’s strategic partnership with ARM aims at accelerating time to market for product development and paves a way to explore new avenues of semiconductor design! Read the full PR article here:

https://www.crn.in/news/tessolve-joins-the-arm-approved-design-partner-program-to-accelerate-time-to-market-for-product-development/

Tessolve expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam to accelerate Tessolve’s ability to provide value to customers globally. Today, though Tessolve offers its solutions across the globe, we see a need for a more integrated approach while supporting our emerging technologies’ customers. We truly become an extended arm of their engineering teams, collaborating from the design drawing board to managing their product orders.

Tessolve raises $40 million from Singapore-based PE firm Novo Tellus

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces that leading Singapore based PE firm Novo Tellus Capital Partners has invested $40M in Tessolve.

Tessolve intends to use this additional fund for acquisitions and investments in key areas of growth and expansion of the business. Besides, this investment provides Tessolve a significant opportunity to accelerate the growth of its Chip Design and ASIC engineering capabilities and further strengthen its global footprint.

Know More

Tessolve Semiconductor is now a certified IPC member

By | News/Press Releases | No Comments

We are proud to announce that Tessolve Semiconductor Pvt. Ltd. is now an IPC member facility. The IPC membership is mainly focused on electronic interconnect industries & brings together the PCB designers, PCB Fabrication, PCB Assembly, Suppliers & OEM’s. And it facilitates members with training, market research, public policy advocacy and extended services.

With the recent membership certification from IPC, the credibility of our PCB design and related competencies has gained a remarkable advantage. This is another step to reaffirm the quality of our PCB Design & Development under Tessolve Offerings.

Tessolve expands its Japanese operations as part of an international expansion plan to capitalize on its VLSI and Embedded business

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces its expansion of Japanese operations indicating its global expansion strategy to drive international revenue growth.

It is almost 5 years since Tessolve has been operational in the Japanese market, one of the high potential global economies. This provides Tessolve an opportunity to expand its business in new territory and focus on VLSI and Embedded business. Besides, Tessolve’s Japanese operations are expected to target various industry markets like Automotive to avionics, consumer electronics to medical and the company’s business operations plans for tomorrow’s customer in 5G, Autonomous driving, Artificial Intelligence, and Virtual Reality.

Recently Tessolve has broadened the Japanese operations through the addition of highly skilled and experienced local Professionals in the progress and execution of business. Hitoshi Eda, Senior Manager, Program Management has joined Tessolve to act as a technical bridge between Japanese customers and the Tessolve engineering team. This expansion strategy will surely help Tessolve to differentiate its service offering and empower its team to engage with clients.

Tessolve Launches Edge Artificial Intelligence (AI) Integrator to build new Intelligent Solution

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, has announced a new Edge AI Integrator solution to transform customer’s connected products into new smart products and solutions.

The powerful combination of the Tessolve AI integrator and IoT offerings can support customers from various industries such as avionics, automotive, industrial and medical markets to build more intelligent solutions from their data.

Our Edge AI solution is the brain behind the IoT body parts to create new smart products and solutions or enhance existing products & services. 

The new edge AI integrator solution can be tailored to customer’s requirements and thus help organizations to augment innovation capabilities, increase working efficiency, improve cybersecurity, and enhance customer experience.

Tessolve is providing the advanced hardware and software capabilities, and the multi-standard connectivity required in the end-to-end IoT business solutions such as predictive maintenance for Industry 4.0, smart metering, enhanced vision systems & consumer products, asset management, …

If you want to find out more, please contact:

David Mudard

Senior Sales Manager – Embedded Systems
Tel: +33 (0) 428-290-800
Mobile: +33 (0) 637-303-732
Email: david.mudard@tessolve.com

Tessolve Digitizes the Complete Operations for Kaapi Machines

By | News/Press Releases | No Comments

We are pleased to announce that the Tessolve Embedded team has Collaborated with Kaapi machines in successfully enabling IOT integration of a commercial coffee vending machine.

The scope of the digitization includes secured contactless coffee dispensing; machine onboarding; beverage management; user management and analytics on consumption.

This solution impacts the full ecosystem: end-users have the safety of contactless dispensing; improved cost management and analytics and efficient management of machines for Kaapi.

Tessolve has created an easy-to-use mobile application for end-users, a desktop application for facility managers and suppliers, and an application for installation and machine onboarding. This is completely digitized and integrated with Tessolve’s IoT framework and customized business logic layer for Kaapi

Tessolve digitization offers a ready-to-use IoT framework comprising connectivity, devices, data, dashboard, and AI which can help in quickly digitizing your business for operational excellence through automation.

For more information please contact:

Satyam Trivedi
Director Engineering IoT Embedded Systems
Tel: + 91 80 66995800
Mobile: 9739536984
Email: satyam.trivedi@tessolve.com

Analog Devices Inc. Recognizes Tessolve At Supplier Day Awards 2020

By | News/Press Releases | No Comments

2020 adds another milestone to Tessolve’s journey with the recognition as the Best in Service and Responsiveness Emerging Supplier Award, supported by its competent engineering team. The accolade was announced at the second edition of the Analog Devices Supplier Day Awards 2020, celebrating the commitments and exemplary performances of ADI partners in established, emerging, and niche categories.

Tessolve was recognized for its outstanding support and contribution to ADI’s success during the past year and bagged the award under the ‘Best in Service and Responsiveness for Emerging as a Niche Supplier’ criteria.

To know more about this prestigious recognition, follow the comments of Steve Lattari, Senior Vice President, ADI Global Operations and Technology, announcing Tessolve as the winner.

Tessolve Joins The STMicroelectronics Partner Program As An Engineering Solution Partner

By | News/Press Releases | No Comments

Tessolve has forged another significant partnership leveraging its advanced engineering capabilities and end-to-end product design services in the embedded domain. Recently, we were recognized as an Engineering Solution Partner by STMicroelectronics – a leading semiconductor manufacturer delivering energy-efficient products.

Joining the robust partner program of STMicroelectronics, Tessolve is now listed as a partner and has been featured on its dedicated partner page. The company is poised to provide Hardware/Software/System services and solutions (based on processors, mems, sensors, applications, etc.), furthering the capabilities of original equipment design, manufacturing, and qualification.

Our Founding Members Embark Into New Journeys At Tessolve

By | News/Press Releases | No Comments

Tessolve steps into a new era as senior leaders begin their elevated journeys, guiding the now and the next steps of the company. We’re proud to announce that our Co-founder and President, Mr. Srinivas Chinamilli, has stepped into the role of Chief Executive Officer (CEO), since October 1st. This allows us to congratulate and celebrate the new journey of Mr. P. Rajamanickam, as he takes over Tessolve as Executive Vice Chairman.
The official announcement of these transitions was made by Tessolve’s parent group – Hero Electronix, early this week. To follow the update and the complete Press Release,

visit: https://m.economictimes.com/industry/cons-products/electronics/hero-electronixs-tessolve-elevates-co-founder-srinivas-chinamilli-as-ceo/articleshow/79015014.cms

CoE Under The Spotlight System Level Test (SLT) for Volume

By | News/Press Releases | No Comments

Tessolve is the market leader in providing engineering solutions for silicon and systems development. Tessolve has taken a further step to establish Centres of Excellence (COE) in the various areas of Test Engineering, VLSI Analog, VLSI Digital, Embedded Systems, Special Projects, and PCB for large scale adoption of newer technologies and innovations. We have been thinking ahead to establish and empower COE, invest in future competencies to leapfrog the competition, identify solutions for complex business problems and develop new areas for growth. This differentiates Tessolve with the other companies that are focused on the narrow offerings.

System Level Test (SLT) for Volume – SLT for Volume is one of the COE that Tessolve had taken in the Test Business Unit (BU). With the help of our deep experience in Chip level Volume test and Systems Level Validation across various type of market segment ( Consumer, Medical, Automotive, Avionics) and Various type of Devices (Digital, PMIC, Mixed-Signal, RF, and SOC) Tessolve had developed a Proof of Concept for a complex IMX6 Processor SLT that can run Use Case Test on a volume using a commercial Handler. This initiative involves cross BU collaboration which includes Test BU, Embedded BU, PCB/ Hardware Engineering & Mechanical engineering teams.

Examples of Solutions Developed by Tessolve for System Level Test for Volume.

Stay tuned for more updates and videos on SLT!

Tessolve gets accredited by National Accreditation Board for Testing and Calibration Laboratories for competence in Testing

By | News/Press Releases | No Comments

The credibility of our Reliability Lab has covered a significant mileage with the recent National Accreditation Board for Testing and Calibration Laboratories (NABL) accreditation. A formal recognition of the lab’s technical competence, this is another step for customers to trust and find reliable testing, under the Tessolve roof.

The accreditation by NABL, a Constituent Board of Quality Council of India, comes after assessing the Reliability Lab as per the ISO/IEC 17025:2017 standard. Almost a year-long process, the assessment was also a learning point to enhance our Technical Documentation and Process competency.

To know more about the Reliability Lab and our recognized testing practices, please visit – http://www.tessolve.com/test-engineering/

Tessolve announced as an In-Kind Partner of Silicon Catalyst

By | News/Press Releases | No Comments

Our journey to becoming the foundation of new innovations in silicon engineering crosses another milestone, with Tessolve announced as an In-Kind Partner (IKP) of Silicon Catalyst. The global silicon solutions incubator announced the partnership last week with Tessolve and 3 other companies inducted to the IKP family.

As a partner, Tessolve will play a critical role, supporting semiconductor start-ups and emerging hardware companies, leveraging its capabilities in the pre and post silicon design, development, testing, and embedded solutions. The Portfolio Companies of Silicon Catalyst will have access to Tessolve’s wide range of services and diverse expertise.

To know more about the partnership and about Silicon Catalyst, follow the complete coverage of the announcement at – https://siliconcatalyst.com/silicon-catalyst-expands-ecosystem-with-4-additional-inkind-partners

Build a remote testing capability

By | News/Press Releases | No Comments

T&VS and Tessolve delivered a webinar on the 23rd April 2020, the topic on Dockerize your testing to enable virtual environments.

We demonstrated best practice on how to Dockerize your testing including test automation and code coverage tools, walking you through our approach and experiences.

Here’s what you can learn from the webinar:

  • Benefits of Dockerizing your testing
  • QA best practice in using Docker environments
  • Tips in creating your virtual Docker containers
  • How to integrate SonarQube for code coverage
  • Understand Docker driven test automation
  • Webinar Presentation

    Docker Container

    About Test and Verification Solutions (T&VS)

    Test and Verification Solutions (T&VS) was formed in the UK in 2008 to provide specialist test and verification services and products to the worldwide semiconductor and embedded systems industries. T&VS is able to deliver start-of-the-art solutions by keeping abreast of latest developments through attending, speaking at and organizing industry conferences and events, and by writing leading edge articles on test and verification methodologies and tools.

    Test and Verification Solutions is a privately held Semiconductor & Systems design firm that brings significant expertise and capabilities in the front-end design activities for Digital IC design. More specifically the T&VS team specializes in Design Verification methodologies, in addition to DV, T&VS has good capability in RTL, DFT and embedded software development projects as well.

    About Tessolve

    Simplifiers of silicon engineering

    Technological innovation has accelerated at an unprecedented pace in the recent years and so have the disruptions in the sector of Silicon engineering – complex IC development, increasing failures, inadequate facilities for design, development and testing. At Tessolve, we address these disruptions, helping Semiconductor product companies in Semiconductor IC Design, Test & Product Engineering, PCB Design, Failure Analysis and Systems design. An enabler of smooth design and productization of chips, we leverage our in-house infrastructure, quality excellence practices and cost-effective approaches to bring value-driven solutions and services.

    Find Out More

    Contact one of our consultants today to discuss your requirements.
    No hard sales, just pertinent questions to understand your needs and to discuss how we may be able to help.

    GET IN TOUCH

    Verification of AI Designs

    By | News/Press Releases | No Comments

    DVClub Europe Meeting – April 2020

    Event at a Glance

    Tuesday 21st April, 2020
    12:00 – 13:20 BST
    FREE to attend Online

    Verification of AI Designs

    With the proliferation of IP and SoCs targeted at the fast growing AI (Artificial Intelligence) market, this event will focus on how such designs can be verified

    TimeSession DescriptionSlidesVideos
    12.00Welcome and Introduction
    Mike Bartley, Senior Vice President – VLSI Design, T&VS
    12.05AI chips must get the math right
    Sergio Marchese, Technical Marketing Manager, OneSpin Solutions
    DownloadView
    12.55An Emulation Strategy for Artificial Intelligence Designs
    Gabriele Pulini, Product Marketing Manager, Mentor a Siemens Business
    DownloadView
    12.30ML Verification Turns Convention on its Head
    Adnan Hamid, CEO/CTO, Breker Verification Systems
    DownloadView
    13.20Close

    About DVClub

    The principal goal of each DVCLUB meeting is to have fun while helping build the European verification community through regular educational and networking events. Attendance at DVClub Europe meetings is free and is open to all non-service provider semiconductor professionals. Each meeting addresses a specific issue faced by the design and verification community and whatever your speciality provides an excellent opportunity for updating knowledge as well as share experiences, insights and issues with other members of the verification community.

    Sponsors

    DVCLUB Europe is made possible through the generosity of our sponsors.

    Tessolve Ready To Step Up As A Capable Semiconductor Supplier In Asia

    By | News/Press Releases | No Comments

    Recent years have seen a growing demand for a robust semiconductor supply chain in Asia. The challenges thrown by Novel Corona Virus Disease has further disrupted the region’s supply, and the need of the hour is a capable partner.

    With a diversified supply chain, Tessolve is more than ready to take the mantle of being an alternate supplier in the region. Our engineers are committed and capable to meet the rising demands, empowered by our robust Printed Circuit Board (PCB) Fabrication unit, in Johor Bahru (JB), Malaysia. With key features such as single to 30-layer fabrication, certified quick turn sample to production, and better failure/risk analysis & DFM, the Fab offers a wide range of PCB manufacturing and assembly services.

    In these turbulent times, technology can be a pivotal force to tackle COVD19, and we’re ready to support as the region’s capable semiconductor supplier. For any queries, we request you reach out at sales@tessolve.com and discuss the next steps with our experts.

    Tessolve strengthens its VLSI Design services with the acquisition of T&VS

    By | News/Press Releases | No Comments

    Tessolve consolidated its position as a leading multinational engineering solution provider with the acquisition of Test & Verification Solutions (T&VS). Tessolve, a part of the Hero Electronics group will now be in a better position to provide full turnkey VLSI design services from RTL to GDSII. The company is uniquely positioned as the only player who can take a high-level specification to a qualified part, given its traditional strength in Post Silicon services for ATE testing, IC Characterization and reference board/system bring up.

    This acquisition will take our existing best in class VLSI design to next level by bringing in an increased depth to the front end design activities (DV/DFT), in catching design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. Apart from the depth into VLSI design capabilities, the acquisition also means a faster realization of turnkey products for its customers in the semiconductors and systems segment.

    Test and Verification Solutions is a privately held Semiconductor & Systems design firm that brings significant expertise and capabilities in the front-end design activities for Digital IC design. More specifically the T&VS team specializes in Design Verification methodologies, in addition to DV, T&VS has good capability in RTL, DFT and embedded software development projects as well.

    T&VS is the fourth strategic acquisition by Tessolve in the last 5 years, adding strength to its ability as a provider of a comprehensive spectrum of services under one roof. Post the acquisition, the current management team at T&VS will remain in place and augments Tessolve’s ability to service and expand into two new high potential markets of the UK, Japan, Korea and also other regions in India such as Chennai, Hyderabad and Noida regions.

    To know more about Test and Verification Solutions (T&VS), visit the company’s website – https://www.testandverification.com/