Tessolve participated at the 2019 GSA European Summit organized by the Global Semiconductor Alliance. David Mudard and Sean Moynagh represented Tessolve at the event. Their exhibit showcased our capabilities in Product Engineering, with solutions and modules designed focused on Automotive Technologies. The duo had an amazing time at the event interacting with industry experts about emerging possibilities in Semiconductor Engineering that are poised to transform Automotive as we know it.
Tessolve launched its VLSI Design Center in Bangalore, on January 31st, 2019. The new office, located on the Outer Ring Road is a setup focused on multi-layer designs of Integrated Circuits.
Tessolve participated in two events in November held at Singapore – the ASEAN Business and Investment Summit (ABIS) and the Semicon50.
Tessolve has successfully launched an ultra-low-power ARM Core-based SOM (System-On-Module) powered by the i.MX8M Family processor of NXP.
It was a proud moment for Tessolve when National Instrument invited us to participate in the VIP Days Keynote Session 2018 held in Oct 2018 at Germany
It is a proud moment for us to share that three PCB Design engineers from Tessolve participated in this IPC conducted PCB Design Contest.