Tessolve Collaborates with Intel Foundry to Support EMIB Advanced Packaging Technology

Tessolve has collaborated with Intel Foundry to support package designs using Embedded Multi-die Interconnect Bridge (EMIB), enabling advanced heterogeneous multi-chiplet architectures. This collaboration strengthens Tessolve’s end-to-end semiconductor design and packaging capabilities, helping Intel Foundry customers accelerate the development of next-generation semiconductor solutions.