Hero Electronix, the parent company of Tessolve, launched another brand under its umbrella last week. The new brand – Qubo – will launch a series of AI-powered intelligent home appliances,…
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Using the SMARC standard 2.0 for embedded modules, Tessolve Embedded Systems introduces ultra-low power ARM COMs (Computer-On-Module) based on the Qualcomm SnapdragonSD820 Family which is powered by 64-bit ARMv8-compliant quad-core...
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Tessolve strengthened its work in the field of Near Field Communication (NFC) based on hybrid technology work as the industry transitioned into the new technological world by adding automation process...
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Tessolve kicks off the multi-city, multi-country demonstration of its TERA device, a key next Generation NXP technology (S32G274A based SMARC SoM) based on state-of-the-art Application Gateway at NXP Technology Days...
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Tessolve, a leading semiconductor engineering service partner, was an integral part of the ITC Test Week India 2022, at Radisson Blue Hotel, Bengaluru between July 24-26. The booth highlighted the...
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Tessolve participated at the SemiconIndia 2022, the post-COVID gigantic conference in the Semiconductor industry. The Hon’ble Prime Minister of India, Shri Narendra Modi, inaugurated the conference via Video Conference on...
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and system companies, is pleased to announce the appointment of two industry veterans, Huzefa Cutlerywala as Senior...
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Tessolve announces its inaugural run of its Test Engineering Lab in San Jose on Mar 23. We offer access to test engineering and program development experts and access to testers....
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We are glad to announce the release of the Jan 22 edition of our Newsletter, First Bin. The newsletter contains a note from our CEO’s Desk, Tessolve Showcase article, and...
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Tessolve’s and DynamoEdge have announced a partnership to deliver the fastest end-to-end mobility solutions powered by AT&T 5G. The strategic collaboration of Tessolve with DynamoEdge has paved the way to...
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The partnership will allow showcasing our end-to-end capabilities in supporting Industrial and Automotive OEM’s safety-related Hardware modules, associated Software technology, innovative Automotive product development, and system validation for various customers...
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Tessolve has joined the GlobalFoundries® (GF®) Design Enablement Network Program. The strategic partnership with GF aims to bring state-of-the-art design solutions across multiple end markets including automotive, industrial, server, graphics,...
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We are thrilled to share another milestone to Tessolve’s journey with the recognition Tessolve has achieved by SiliconIndia among The 10 Best Electronics Companies to Work For in Bangalore 2021....
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Tessolve is now a member of the Arm® Approved Design Partner program, a global network of product design service companies endorsed by Arm. Tessolve's strategic partnership with ARM aims at...
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Tessolve, a Hero Electronix venture expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam to accelerate Tessolve’s ability to provide value to customers...
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces that leading Singapore based PE firm Novo Tellus Capital Partners has invested $40M...
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We are proud to announce that Tessolve Semiconductor Pvt. Ltd. is now an IPC member facility. The IPC membership is mainly focused on electronic interconnect industries & brings together the...
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces its expansion of Japanese operations indicating its global expansion strategy to drive international...
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It has been a challenging 2020! Tessolve team was able to quickly adapt to the new norm ensured continuity and best of support to you all. Know More: Download
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, has announced a new Edge AI Integrator solution to transform customer’s connected products into...
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We are pleased to announce that the Tessolve Embedded team has Collaborated with Kaapi machines in successfully enabling IOT integration of a commercial coffee vending machine. The scope of the...
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2020 adds another milestone to Tessolve’s journey with the recognition as the Best in Service and Responsiveness Emerging Supplier Award, supported by its competent engineering team. The accolade was announced...
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Tessolve has forged another significant partnership leveraging its advanced engineering capabilities and end-to-end product design services in the embedded domain. Recently, we were recognized as an Engineering Solution Partner by...
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Tessolve steps into a new era as senior leaders begin their elevated journeys, guiding the now and the next steps of the company. We’re proud to announce that our Co-founder...
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Tessolve is the market leader in providing engineering solutions for silicon and systems development. Tessolve has taken a further step to establish Centres of Excellence (COE) in the various areas...
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The credibility of our Reliability Lab has covered a significant mileage with the recent National Accreditation Board for Testing and Calibration Laboratories (NABL) accreditation. A formal recognition of the lab’s...
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Our journey to becoming the foundation of new innovations in silicon engineering crosses another milestone, with Tessolve announced as an In-Kind Partner (IKP) of Silicon Catalyst. The global silicon solutions...
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T&VS and Tessolve delivered a webinar on the 23rd April 2020, the topic on Dockerize your testing to enable virtual environments. We demonstrated best practice on how to Dockerize your...
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DVClub Europe Meeting – April 2020 Event at a Glance Tuesday 21st April, 2020 12:00 – 13:20 BST FREE to attend Online Verification of AI Designs With the proliferation of...
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Recent years have seen a growing demand for a robust semiconductor supply chain in Asia. The challenges thrown by Novel Corona Virus Disease has further disrupted the region’s supply, and...
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Tessolve consolidated its position as a leading multinational engineering solution provider with the acquisition of Test & Verification Solutions (T&VS). Tessolve, a part of the Hero Electronics group will now...
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Tessolve is now a proud member of LUX Photonics Consortium and will be part of the Photonics ecosystem in Singapore. We are basically 'the catalysts' to propel Singapore's Photonics Industry,...
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Last week, Tessolve participated in the 22nd edition of Bengaluru Tech Summit 2019, organized by the Dept. of IT & BT, Government of Karnataka. The summit, held at the Bengaluru...
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Tessolve participated at the Qualcomm Information Forum 2019, reinforcing its commitment to engineering new possibilities for Qualcomm. The event, held at Whitefield, Bengaluru on 17th October 2019, was the platform...
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Tessolve Highlights Its Product Engineering At The India Mobile Congress 2019 With Qualcomm And Hero Electronix Tessolve participated at the India Mobile Congress 2019 along with its parent company -...
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Hero Electronix, the parent company of Tessolve, launched another brand under its umbrella last week. The new brand – Qubo – will launch a series of AI-powered intelligent home appliances,…
It was an eventful Independence Week for Tessolvians at the Bangalore office, celebrating Independence Day with fun-filled activities.
Tessolve, a leading semiconductor engineering service partner, was an integral part of the 2019 chapter of ITC (International Test Conference) India
Commemorating its 15th year of semiconductor engineering journey, Tessolve hosted a lunch panel at the GSA Silicon Summit on 18th June at Santa Clara, California.
Tessolve, participating as a Platinum Sponsor, will be there at the Leela Palace, Bengaluru, between July 21-23
National Instruments recently announced the launch of its quad-site mmWave 5G packaged test solution, aimed to reduce the incurred cost
David Mudard, Sales Manager at Tessolve was recently featured in an article published on the Electroniques magazine.
Tessolve recently participated at the NI Week 2019 event, which was successfully orchestrated by National Instruments, between May 20-23 in Austin, Texas.
Tessolve participated at the VOICE 2019, Singapore, the first edition of the annual Advantest Developer Conference
On 12th May, Tessolve had organized the Tessolve Family Run at the Gold Coins Club & Resort, which witnessed positive responses, right from the registrations. Around 400+ employees and their…
Tessolve participated at the 2019 GSA European Summit organized by the Global Semiconductor Alliance. David Mudard and Sean Moynagh represented Tessolve at the event. Their exhibit showcased our capabilities in…
Tessolve was the Platinum sponsor for the largest event on ESDM in South Asia – the IESA Vision Summit 2019
Tessolve launched its VLSI Design Center in Bangalore, on January 31st, 2019. The new office, located on the Outer Ring Road is a setup focused on multi-layer designs of Integrated Circuits.
Tessolve, a Hero Electronix venture, recently inaugurated its dedicated Semiconductor Chip Design Center in Bengaluru.
Tessolve participated in the 21st edition of Bengaluru Tech Summit – the flagship event of the Dept. of IT & BT, Government of Karnataka.
Tessolve participated in the 21st edition of Bengaluru Tech Summit – the flagship event of the Dept. of IT & BT, Government of Karnataka.
Tessolve has successfully launched an ultra-low-power ARM Core-based SOM (System-On-Module) powered by the i.MX8M Family processor of NXP.
It was a proud moment for Tessolve when National Instrument invited us to participate in the VIP Days Keynote Session 2018 held in Oct 2018 at Germany
DRDO has issued CEMILAC certificate to Qualify Tessolve for having the Technical Capabilities and Infrastructure to Design and Develop Avionics Grade Hardware for Deployment in Fighter Aircrafts and Helicopters.
