A penetration test tells whether the existing defensive measures employed on the system are strong enough to prevent any security break. Understand how T&VS Automotive services help you protect &…
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Keeping you up-to-date, everytime
We are happy to announce part 3 of the IESA Annual Member Meet webinar series, in which Tessolve CEO Mr. P Raja Manickam, will be addressing the opportunities and the…
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Hero Electronix, the parent company of Tessolve, launched another brand under its umbrella last week. The new brand - Qubo - will launch a series of AI-powered intelligent home appliances,…
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Using the SMARC standard 2.0 for embedded modules, Tessolve Embedded Systems introduces ultra-low power ARM COMs (Computer-On-Module) based on the Qualcomm SnapdragonSD820 Family which is powered by 64-bit ARMv8-compliant quad-core…
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Tessolve strengthened its work in the field of Near Field Communication (NFC) based on hybrid technology work as the industry transitioned into the new technological world by adding automation process…
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Tessolve kicks off the multi-city, multi-country demonstration of its TERA device, a key next Generation NXP technology (S32G274A based SMARC SoM) based on state-of-the-art Application Gateway at NXP Technology Days…
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Tessolve, a leading semiconductor engineering service partner, was an integral part of the ITC Test Week India 2022, at Radisson Blue Hotel, Bengaluru between July 24-26. The booth highlighted the…
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Tessolve participated at the SemiconIndia 2022, the post-COVID gigantic conference in the Semiconductor industry. The Hon’ble Prime Minister of India, Shri Narendra Modi, inaugurated the conference via Video Conference on…
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and system companies, is pleased to announce the appointment of two industry veterans, Huzefa Cutlerywala as Senior…
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Tessolve announces its inaugural run of its Test Engineering Lab in San Jose on Mar 23. We offer access to test engineering and program development experts and access to testers.…
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We are glad to announce the release of the Jan 22 edition of our Newsletter, First Bin. The newsletter contains a note from our CEO’s Desk, Tessolve Showcase article, and…
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Tessolve’s and DynamoEdge have announced a partnership to deliver the fastest end-to-end mobility solutions powered by AT&T 5G. The strategic collaboration of Tessolve with DynamoEdge has paved the way to…
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The partnership will allow showcasing our end-to-end capabilities in supporting Industrial and Automotive OEM’s safety-related Hardware modules, associated Software technology, innovative Automotive product development, and system validation for various customers…
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Tessolve has joined the GlobalFoundries® (GF®) Design Enablement Network Program. The strategic partnership with GF aims to bring state-of-the-art design solutions across multiple end markets including automotive, industrial, server, graphics,…
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We are thrilled to share another milestone to Tessolve’s journey with the recognition Tessolve has achieved by SiliconIndia among The 10 Best Electronics Companies to Work For in Bangalore 2021.…
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Tessolve is now a member of the Arm® Approved Design Partner program, a global network of product design service companies endorsed by Arm. Tessolve's strategic partnership with ARM aims at…
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Tessolve, a Hero Electronix venture expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam to accelerate Tessolve’s ability to provide value to customers…
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces that leading Singapore based PE firm Novo Tellus Capital Partners has invested $40M…
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We are proud to announce that Tessolve Semiconductor Pvt. Ltd. is now an IPC member facility. The IPC membership is mainly focused on electronic interconnect industries & brings together the…
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces its expansion of Japanese operations indicating its global expansion strategy to drive international…
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It has been a challenging 2020! Tessolve team was able to quickly adapt to the new norm ensured continuity and best of support to you all.Know More:
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Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, has announced a new Edge AI Integrator solution to transform customer’s connected products into…
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We are pleased to announce that the Tessolve Embedded team has Collaborated with Kaapi machines in successfully enabling IOT integration of a commercial coffee vending machine. The scope of the…
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2020 adds another milestone to Tessolve’s journey with the recognition as the Best in Service and Responsiveness Emerging Supplier Award, supported by its competent engineering team. The accolade was announced…
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Tessolve has forged another significant partnership leveraging its advanced engineering capabilities and end-to-end product design services in the embedded domain. Recently, we were recognized as an Engineering Solution Partner by…
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Tessolve steps into a new era as senior leaders begin their elevated journeys, guiding the now and the next steps of the company. We’re proud to announce that our Co-founder…
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Tessolve is the market leader in providing engineering solutions for silicon and systems development. Tessolve has taken a further step to establish Centres of Excellence (COE) in the various areas…
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The credibility of our Reliability Lab has covered a significant mileage with the recent National Accreditation Board for Testing and Calibration Laboratories (NABL) accreditation. A formal recognition of the lab’s…
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Our journey to becoming the foundation of new innovations in silicon engineering crosses another milestone, with Tessolve announced as an In-Kind Partner (IKP) of Silicon Catalyst. The global silicon solutions…
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T&VS and Tessolve delivered a webinar on the 23rd April 2020, the topic on Dockerize your testing to enable virtual environments. We demonstrated best practice on how to Dockerize your…
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DVClub Europe Meeting – April 2020 Event at a Glance Tuesday 21st April, 202012:00 – 13:20 BSTFREE to attend Online Verification of AI Designs With the proliferation of IP and…
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Recent years have seen a growing demand for a robust semiconductor supply chain in Asia. The challenges thrown by Novel Corona Virus Disease has further disrupted the region’s supply, and…
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Tessolve consolidated its position as a leading multinational engineering solution provider with the acquisition of Test & Verification Solutions (T&VS). Tessolve, a part of the Hero Electronics group will now…
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Tessolve is now a proud member of LUX Photonics Consortium and will be part of the Photonics ecosystem in Singapore. We are basically 'the catalysts' to propel Singapore's Photonics Industry,…
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Last week, Tessolve participated in the 22nd edition of Bengaluru Tech Summit 2019, organized by the Dept. of IT & BT, Government of Karnataka. The summit, held at the Bengaluru…
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Tessolve participated at the Qualcomm Information Forum 2019, reinforcing its commitment to engineering new possibilities for Qualcomm. The event, held at Whitefield, Bengaluru on 17th October 2019, was the platform…
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Tessolve Highlights Its Product Engineering At The India Mobile Congress 2019 With Qualcomm And Hero Electronix Tessolve participated at the India Mobile Congress 2019 along with its parent company -…
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Hero Electronix, the parent company of Tessolve, launched another brand under its umbrella last week. The new brand - Qubo - will launch a series of AI-powered intelligent home appliances,…
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It was an eventful Independence Week for Tessolvians at the Bangalore office, celebrating Independence Day with fun-filled activities.
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Tessolve, a leading semiconductor engineering service partner, was an integral part of the 2019 chapter of ITC (International Test Conference) India
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Commemorating its 15th year of semiconductor engineering journey, Tessolve hosted a lunch panel at the GSA Silicon Summit on 18th June at Santa Clara, California.
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Tessolve, participating as a Platinum Sponsor, will be there at the Leela Palace, Bengaluru, between July 21-23
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National Instruments recently announced the launch of its quad-site mmWave 5G packaged test solution, aimed to reduce the incurred cost
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David Mudard, Sales Manager at Tessolve was recently featured in an article published on the Electroniques magazine.
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Tessolve recently participated at the NI Week 2019 event, which was successfully orchestrated by National Instruments, between May 20-23 in Austin, Texas.
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Tessolve participated at the VOICE 2019, Singapore, the first edition of the annual Advantest Developer Conference
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On 12th May, Tessolve had organized the Tessolve Family Run at the Gold Coins Club & Resort, which witnessed positive responses, right from the registrations. Around 400+ employees and their…
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Tessolve participated at the 2019 GSA European Summit organized by the Global Semiconductor Alliance. David Mudard and Sean Moynagh represented Tessolve at the event. Their exhibit showcased our capabilities in…
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Tessolve was the Platinum sponsor for the largest event on ESDM in South Asia - the IESA Vision Summit 2019
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Tessolve launched its VLSI Design Center in Bangalore, on January 31st, 2019. The new office, located on the Outer Ring Road is a setup focused on multi-layer designs of Integrated…
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Tessolve, a Hero Electronix venture, recently inaugurated its dedicated Semiconductor Chip Design Center in Bengaluru.
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Tessolve participated in the 21st edition of Bengaluru Tech Summit - the flagship event of the Dept. of IT & BT, Government of Karnataka.
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Tessolve participated in the 21st edition of Bengaluru Tech Summit - the flagship event of the Dept. of IT & BT, Government of Karnataka.
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Tessolve has successfully launched an ultra-low-power ARM Core-based SOM (System-On-Module) powered by the i.MX8M Family processor of NXP.
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