Tessolve Semiconductor Malaysia (TSM) participated in this event which was organized by Semi Singapore from 25th April 2017 to 27th April 2017. Participants from several Asian countries took part in this event ranging from various Engineering fields.
TSM booth was set up with our Engineering services portfolio as well as our newly acquired PCB Fabrication plant with PCB boards displayed during the 3-day exhibition. We had several enquiries expressing interest in our Product portfolio as well as our design capabilities in PCB Fabrication. There were several card exchanges and interactions between our Technical staff who were stationed during the 3-day duration as well as potential customers.