AI chiplets are emerging as a breakthrough innovation in semiconductor design—enabling smarter, faster, and more scalable solutions for modern computing demands.
In a recent ET Edge Insights feature, Madhav Rao, SVP – VLSI at Tessolve, shares how chiplet-based architectures are driving a shift in how high-performance and automotive-grade systems are built. From disaggregated SoC design to heterogeneous integration, the chiplet approach is unlocking improved energy efficiency, greater design flexibility, and faster time-to-market.
Whether it’s enhancing ADAS capabilities or boosting data center performance, chiplets are shaping a new era in silicon innovation.
