Tessolve Showcases Advanced Product Engineering at the SemiconIndia 2022 Conference.

By May 3, 2022News/Press Releases

Tessolve participated at the SemiconIndia 2022, the post-COVID gigantic conference in the Semiconductor industry. The Hon’ble Prime Minister of India, Shri Narendra Modi, inaugurated the conference via Video Conference on 29th April 2022 to make India a global hub for Semiconductor Design, Manufacturing, and Technology Development.

At the event booth, Tessolve highlighted the story of defining engineering success end to end through Design Test & Production. In meaningful conversations, the embedded team participating at the event demonstrated Tessolve’s Product Engineering service and IoT offerings on Industrial, Connected Cars, Smart Lighting, IoT Bricks-Sensors, Connectivity Modules, and Gateway. Our engineering team has displayed our Load boards and the various embedded products interestingly with appropriate brochures. We had visitors from Startups, Academia, and Global Industry Leaders to learn more about Tessolve, our services portfolio, and our role in the latest technologies.