Powering Next-Generation
Trusted by leading technology companies for end-to-end silicon engineering
Innovative Semiconductor Design
Simplifying design complexities while
accelerating GTMs
We deliver comprehensive Spec-to-GDSII solutions across analog, digital, and mixed-signal domains. Our expertise spans architecture definition, RTL design, verification, physical design, and silicon validation.
By integrating these capabilities under one engineering framework, we help optimize PPA, minimize design iterations, mitigate risk, and accelerate tape-out timelines, enabling faster and more predictable product realization.
Turning Complex Chip Designs into Engineered VLSI
Built for accuracy, predictability, and scale
Feasibility Study
Our engineers invest time to understand your VLSI chips and development needs deeply align.
Designer at Work
We plan and design our chips, considering testing and production, as well as the final product.
Support Excellence
We support VLSI and chip design & development with our in-house infrastructure.
Testing Proficiency
Our expertise in diverse testing methods subjects VLSI chips to scenarios, delivering insights.
From The Experts’ Eye
The next in our VLSI design and its growth story
Experience how we shape market leadership on VLSI growth strategy through horizontal skill development and vertical solutions.
Detailing VLSI Design Capability
From DFT to error-free Physical Design – we chip in with precision
Analog & Mixed-Signal Design
RTL Design
Design Verification (DV)
Design for Test (DFT)
How We Work
Technology migration isn’t just about moving data from one node to another. It’s about preserving
performance, intent, and reliability while adapting to a new process.
At Tessolve, we follow a structured six-step approach that ensures every design is carefully validated,
aligned, and optimized, delivering silicon that is ready for manufacturing in the destination technology.
Analog & Mixed-Signal (AMS) Design
Custom analog and mixed-signal design from concept to silicon[SK3.1]
Tessolve delivers end-to-end analog and mixed-signal (AMS) design services, spanning specification, design, layout, signoff, and post-silicon validation across both mature and advanced process nodes.
Highlights
- Complete AMS design lifecycle ownership
- Block-level and full-chip IP development
- Proven delivery on CMOS and FinFET technologies
- End-to-end responsibility from specs to GDSII
Process Nodes Supported
3nm | 5nm | 7nm | 10nm | 14nm | 22nm | 45nm | 65nm | 90nm | 130nm | 180nm | 350nm
Industry Experience
Automotive | Communications | Consumer | Medical | IoT
RTL Design
Scalable RTL development and SoC integration
Tessolve provides RTL design services for IP and SoC development, with a focus on large-scale integration and quality, power, and performance.
Highlights
- Standard and complex IP block development
- SoC and subsystem integration, clock/reset design
- Low-power RTL design with UPF
- RTL quality checks: Lint, CDC, low-power checks
- Protocol expertise: PCIe, USB, MIPI, AMBA, DDR, I2C, SPI, UART
Design Verification
Sector-agnostic verification across IPs and SoCs
Tessolve provides comprehensive design verification services to ensure functional correctness, coverage closure, and quality across IP and SoC designs. Our teams use proven methodologies and tools to manage verification complexity, reduce risk, and support predictable tape-out schedules.
Highlights
- Standard and complex IP block development
- SoC and subsystem integration, clock/reset desig
- Low-power RTL design with UPF
- RTL quality checks: Lint, CDC, low-power checks
- Protocol expertise: PCIe, USB, MIPI, AMBA, DDR, I2C, SPI, UART
Design for Test (DFT)
Improving test coverage and silicon quality
Tessolve provides comprehensive DFT services to enhance testability, yield, and first-pass silicon success, supported by strong post-silicon debug capabilities.
Highlights
- DFT architecture and scan methodology
- RTL-level DFT quality checks
- Scan insertion, ATPG generation, and verification
- Memory BIST and boundary scan
- Fault coverage analysis and post-silicon debug support
Design for Test/Debug (DFT/DFD)
Case Study PDF Download
Physical Design
From netlist to tape-out-ready layout
Tessolve delivers end-to-end physical design services, transforming front-end designs into optimized layouts that meet timing, power, and area goals.
Highlights
- Mixed-signal SoC execution from spec to silicon
- Expertise in complex IPs and high-performance subsystems
- Timing closure for designs up to 3GHz
- Advanced-node support down to 3nm
- Low-power implementation and signoff readiness
Know More
Case Study PDF Download
FPGA & Emulation
Early validation through prototyping and emulation
Tessolve enables early hardware validation using FPGA prototyping and emulation to accelerate system debugging and software
Highlights
- Experience with AMD and Intel FPGA platforms
- FPGA-based emulation and design partitioning
- Custom Silicon-to-FPGA and FPGA-to-Custom Silicon conversion
- Custom board development and FPGA validation
Foundry Porting Services
Reliable migration across process nodes and foundries
Tessolve enables seamless porting of existing VLSI designs to new technologies or foundries while preserving original functionality, performance, and specifications. Our structured and automation-driven approach ensures predictable outcomes with minimal risk.
Highlights
- Schematic, layout, and testbench migration across source and target
foundries - Parameter and device mapping across heterogeneous PDKs
- Automated scripting to handle symbol, model, and rule differences
- Reusable porting flows for faster turnaround on repeat migrations
- Full functional and performance verification post-migration
Porting Methodology
- Adaptation of schematics and layouts to target process design rules
- Script-based translation of parameters, symbols, and model references
- Integration with target foundry model files and simulation setup
- Comprehensive verification to ensure spec and functional equivalence
