DRDO Event
Agenda for Internal Session
Workshop Runsheet
Session Agenda
| Time | Topic | Presenter | Key Focus |
|---|---|---|---|
| 10:15 – 10:25 AM | Welcome & Workshop Overview | Bharath/Ganesan | Introduction to airborne embedded systems, workshop objectives, development lifecycle overview |
| 10:25 – 10:45 AM | Concept to Product Development Journey | Bharath/ Ganesan | System architecture, development phases, technology selection, airborne design challenges, certification awareness |
| 10:45 – 11:05 AM | Specifications to Design & Validation | Srinidhi | Requirement capture, system specifications, design decomposition, traceability, verification and validation planning |
| 11:05 – 11:10 AM | Transition & Q&A — Interactive discussion | ||
| 11:10 – 11:30 AM | FPGA-Based Embedded Systems for Airborne Applications | Raju Bhandarai/ Sadanand | FPGA fundamentals, architecture selection, airborne use cases, design flow overview |
| 11:30 – 11:50 PM | FPGA Design Implementation & Integration | Raju Bhandarai/ Sadanand | RTL development, IP integration, simulation, timing closure, hardware bring-up considerations |
| 11:50 – 11:55 PM | Transition & Q&A — Interactive discussion | ||
| 11:55 – 12:15 PM | PCB Design, Layout & System Packaging | Nataraju | Schematic-to-layout flow, multilayer boards, packaging technologies, SIP (System-in-Package) concepts, designfor-manufacturing considerations |
| 12:15 – 12:35 PM | Signal Integrity & Power Integrity in High-Speed Systems | Rajesh B J | SI/PI fundamentals, routing challenges, stack-up planning, EMI/EMC awareness |
| 12:35 – 12:55 PM | Mechanical Design & Thermal Analysis | Vinod Kumar | Enclosure design, airborne environmental requirements, thermal management, vibration considerations |
| Time | Topic | Presenter | Key Focus |
|---|---|---|---|
| 12:55 – 1:15 PM | System Validation, Manufacturing Readiness & Closing Discussion | Panel (All Speakers) | Prototype realization, qualification strategy, manufacturing readiness, participant Q&A |
| 1:15 – 2:00 PM | Lunch & Networking | ||
| Batch | Location | Tour Lead | Coverage |
|---|---|---|---|
| Batch A | Reliability Lab | Reliability Team | Environmental testing, vibration, thermal cycling, qualification methodology |
| Batch B | ATE Lab | ATE Team | Automated test systems, production test flow, board-level validation |
| Batch C | Engineering Interaction Zone / Demo Area | FPGA & PCB Team | FPGA development boards, PCB samples, packaging examples, design review artifacts |
| Batch | Location | Tour Lead | Coverage |
|---|---|---|---|
| Batch A | ATE Lab | ATE Team | Automated testing and production validation |
| Batch B | Engineering Interaction Zone / Demo Area | FPGA & PCB Team | FPGA demonstrations, PCB realization examples |
| Batch C | Reliability Lab | Reliability Team | Qualification and reliability testing |
| 3:15 – 3:25 PM | Reconvene at Main Hall |
| 3:25 – 3:30 PM | Workshop Wrap-up, Feedback Collection & Group Photograph |

