The year 2025 marked an important stage in Tessolve’s growth. Our focus during the year was clear and practical: strengthen core engineering capabilities, improve global delivery, and build the foundation required to support increasingly complex semiconductor and system programs.
As customer requirements expanded across silicon, software, and systems, we continued to support programs across the full product lifecycle. This included early design and validation through to deployment and scale, across multiple industries and geographies.
A Year Anchored in Strategic Growth
In 2025, we continued to invest in expanding our semiconductor and system engineering capabilities with an emphasis on sustainable growth. Customer demand increasingly shifted toward integrated engineering services, spanning chip design, validation, embedded software, testing, and product engineering.
One of the key developments during the year was the USD 150 million investment from TPG Growth, among the largest fundraises by an Indian semiconductor engineering services company. This investment aligned with our long-term direction and supported our plans to scale capabilities across markets and technologies.
The investment is being deployed across several priority areas:
- Expanding global delivery operations to support customer programs more closely
- Strengthening advanced semiconductor test laboratories to address complex validation requirements
- Increasing R and D investments in emerging and next-generation technologies
- Evaluating strategic acquisitions aligned with long-term capability expansion
This milestone placed Tessolve among a small group of Indian engineering services companies to have raised more than USD 100 million, reflecting the scale of our growth and ambition in the global engineering ecosystem.
Strengthening End-to-End Semiconductor and System Engineering
Throughout 2025, we continued to refine our integrated engineering model to address the convergence of hardware, software, and systems. Customers increasingly require partners who can manage complexity across the full product lifecycle, and our end-to-end approach supports this need.
Our focus areas during the year included:
- Automotive electronics and software-defined vehicles
- AI-enabled systems and intelligent edge platforms
- High-performance computing
- Connectivity and next-generation embedded solutions
To support developments in the automotive industry, we joined the eSync Alliance and contributed to industry efforts around over-the-air updates, connected vehicles, and software-defined platforms. This engagement strengthens alignment with evolving automotive standards.
We also achieved Vector certification during the year, reinforcing our embedded software processes and alignment with global automotive quality and compliance requirements. This supports customer programs involving safety-critical and mission-critical systems.
Dream Chip Technologies: Innovation Across Automotive and Imaging
Dream Chip Technologies continued to progress across automotive, imaging, and high-performance semiconductor platforms during 2025.
Key developments included:
- A collaboration with proteanTecs focused on functional safety, reliability, and real-time monitoring for automotive and high-performance SoCs, addressing challenges in advanced silicon validation and lifecycle management
- The showcase of AtomTwo, one of the world’s smallest global-shutter broadcast cameras, at NAB Show 2025, gaining visibility across professional broadcast and live sports applications
- The announcement of the Atom Two Rainproof POV Camera, designed for demanding outdoor environments, expanding Dream Chip’s presence in professional imaging ahead of IBC 2025
- A joint presentation with Cadence at embedded world 2025, demonstrating an advanced automotive SoC with vision and AI processing for ADAS and automotive applications
Together, Tessolve and Dream Chip continue to deliver engineering solutions across automotive electronics, imaging systems, AI-driven platforms, and high-performance semiconductor designs.
Global Collaboration and Engineering Delivery
Our globally integrated delivery model remained central to how we executed programs in 2025. Teams across India, the USA, and Europe worked closely to support customers across regions and time zones.
Alongside delivery, we continued to invest in people development and engineering culture. Structured learning programs, leadership development, and skill-building initiatives supported teams working on complex, multi-domain engineering programs.
Trusted Partnerships Across Industries
During 2025, we continued to work closely with customers across several industries, including:
- Semiconductor and fabless design companies
- Automotive OEMs and Tier-1 suppliers
- Hi-tech and industrial electronics companies
- AI-, compute-, and connectivity-focused platforms
These partnerships are built through long-term collaboration, technical depth, and consistent execution.
Looking Ahead to 2026
As we move into 2026, our focus remains on scaling capabilities, strengthening ecosystem partnerships, and building deeper engineering expertise across semiconductor and system domains. Expanded delivery capacity and targeted investments support our ability to address increasing program complexity and evolving customer needs.
The work carried out in 2025 has strengthened our engineering foundations and delivery model, creating a solid base for sustained execution and long-term growth.
