Skip to main content
We Believe image
20s Yesrs Success 1

Tessolve Revolutionizes Next-Generation Products with Silicon and Systems Solutions

Productization of next-gen Semiconductor products, from Design to Silicon and Systems, by constant innovation and technical competence. Tessolve unlocks the potential of next-generation semiconductors for our clients. Through seamless design, testing, and embedded system integration, we deliver innovative, cost-optimized solutions and maximize performance that accelerate product launches. With nearly two decades of engineering excellence, Tessolve empowers clients to bring next-generation semiconductors to life.

Where there’s a possibility, there’s a product

Numbers telling our growth story

2004
Till Date - MultipleChips Transformed
3000
Rising Team of
Experts to
900
Test Program
Released
130
PCB Designs Per
Month
40
Products

Between Possibilities And Products

Pillars of expertise become the bridge

Tessolve roadmap 2
Tessolve roadmap

Embedded within these milestones is our people expertise – technologists, innovators, and thought leaders leading every engagement from a silicon-first perspective.

Industries We’ve Partnered With

Our footprints in their silicon/systems led success

Values Delivered On The Way

People, tech, and transparency to weave a difference

Innovation Possibilities icon
Our COE programs productize cutting-edge tech – advancing product innovation possibilities
Values Delivered icon
Uniquely positioned to lead customers from idea to final product on years of silicon engineering and embedded expertise.
Values Delivered icon
Transparency on what really works, rather than just implementing ensures consistent quality in every product.
Values Delivered icon
End-to-end Capability to manage the infrastructure – foundry, back-end assembly, and supply chain.

Spectrum Of Offerings

Converging pre-silicon to post-silicon and turnkey expertise

ASIC Design

Innovative semiconductor design services encompassing RTL Design, DV, Emulation, FPGA, Physical design, DFT, etc., with the ability to seamlessly transition from design to development to production. With a strong focus on quality, reliability, and cost-effectiveness, Tessolve delivers cutting-edge ASIC Design solutions for various applications such as AI, IoT, automotive, and more that meet the diverse needs of customers.

ASIC Design icon
Package Engineering

Expediting package engineering research and design roadmaps while ensuring cost optimizations for clients. Using advanced design tools and methodologies, Tessolve company’s package engineering team helps customers optimize their packaging solutions’ performance, reliability, and cost.

Package Engineering icon
Post Silicon Support

A comprehensive post-silicon service continuum that includes test engineering, product engineering, and validations, ensuring faster time-to-market. Tessolve services for post-silicon support are designed to help semiconductor companies bring their products to market promptly.

Post Silicon Support image
PCB Design

we specialize in delivering comprehensive PCB solutions, covering schematic design to fully assembled boards. Our expertise extends to advanced silicon hardware engineering, encompassing PCB design, development, and efficient delivery.

Hardware Competency icon
Turnkey
Development

Our end-to-end product design services offer comprehensive solutions encompassing the entire process from concept development to manufacturing, ensuring a seamless and efficient journey for embedded hardware.

Turnkey development icon
SOM & EVK

Our expertise lies in designing advanced embedded systems, providing smarter, smaller, and more sophisticated solutions. Through our SOM and EVK services, we enable cutting-edge technology development for embedded solutions.

SOM EVK image
Embedded Design

Tessolve provides end-to-end product design services in the embedded design solution domain, encompassing the entire journey from concept development to manufacturing.

Embedded Design image

The World Of Tessolve

Built on engineering expertise, furthered by innovative minds

Over the past 20+ years, Tessolve has become one of the most trusted companies in semiconductor, chip design, and embedded solutions, made possible through our dedicated people. We are an open hub, allowing Tessolvians to challenge, innovate, and create—VIBE without boundaries.

Our commitment to engineering expertise and innovative thinking has enabled us to stay at the forefront of the industry, providing our clients with cutting-edge solutions that meet their evolving needs. At Tessolve, we are proud of our legacy and excited about the future possibilities.

The World Of Tessolve image
Vibe image 2

Veracity in every
action we plan

Vibe icon 4

Innovative mindset to
think out of the box

Vibe icon 3

Bold in taking necessary
tough decisions

Vibe image 1

Empathy for all
(peers, partners, clients)

Brands We Helped

Engineering their “Needs” to “Next-gen Solutions”

Our Space Of Updates

A trove of the latest highlights and thought leadership

Mk 1
Blogs
July 23, 2024

Revolutionizing India’s Semiconductor Future: The Power of RISC-V Innovation

India's semiconductor industry has witnessed remarkable growth and innovation in recent years, fueled by strategic partnerships, technological advancements, and initiatives like the Digital India RISC-V Microprocessor (DIR-V) Programme. Once heavily…
Sem Ind
Events
July 17, 2024

Semicon India 2024

September 11th- 13th, 2024Tessolve invites you to Semicon India 2024, focusing on Embedded and VLSI Design. Join us in Greater Noida to explore the latest trends and innovations in the…
T Img B
News
July 25, 2024

Tessolve Partners with SigmaSense to Develop their Innovative DSP-based Sensing ASIC

We are excited to announce a strategic collaboration with SigmaSense to develop an innovative DSP-based sensing ASIC. This advanced mixed signal ASIC features a low-power touch-sense controller chip integrated with…

Thinking Of A Possibility?
Let’s Ensure There’s A Product

Close Menu