DRDO Event – Tessolve

DRDO Event

Agenda for Internal Session

Workshop Runsheet

Session Agenda

Morning Sessions
TimeTopicPresenterKey Focus
10:15 – 10:25 AM Welcome & Workshop Overview Bharath/Ganesan Introduction to airborne embedded systems, workshop objectives, development lifecycle overview
10:25 – 10:45 AM Concept to Product Development Journey Bharath/ Ganesan System architecture, development phases, technology selection, airborne design challenges, certification awareness
10:45 – 11:05 AM Specifications to Design & Validation Srinidhi Requirement capture, system specifications, design decomposition, traceability, verification and validation planning
11:05 – 11:10 AM Transition & Q&A — Interactive discussion
11:10 – 11:30 AM FPGA-Based Embedded Systems for Airborne Applications Raju Bhandarai/ Sadanand FPGA fundamentals, architecture selection, airborne use cases, design flow overview
11:30 – 11:50 PM FPGA Design Implementation & Integration Raju Bhandarai/ Sadanand RTL development, IP integration, simulation, timing closure, hardware bring-up considerations
11:50 – 11:55 PM Transition & Q&A — Interactive discussion
11:55 – 12:15 PM PCB Design, Layout & System Packaging Nataraju Schematic-to-layout flow, multilayer boards, packaging technologies, SIP (System-in-Package) concepts, designfor-manufacturing considerations
12:15 – 12:35 PM Signal Integrity & Power Integrity in High-Speed Systems Rajesh B J SI/PI fundamentals, routing challenges, stack-up planning, EMI/EMC awareness
12:35 – 12:55 PM Mechanical Design & Thermal Analysis Vinod Kumar Enclosure design, airborne environmental requirements, thermal management, vibration considerations
Afternoon
TimeTopicPresenterKey Focus
12:55 – 1:15 PM System Validation, Manufacturing Readiness & Closing Discussion Panel (All Speakers) Prototype realization, qualification strategy, manufacturing readiness, participant Q&A
1:15 – 2:00 PM Lunch & Networking
Rotation Schedule
Slot 1 2:00 PM – 2:30 PM
BatchLocationTour LeadCoverage
Batch A Reliability Lab Reliability Team Environmental testing, vibration, thermal cycling, qualification methodology
Batch B ATE Lab ATE Team Automated test systems, production test flow, board-level validation
Batch C Engineering Interaction Zone / Demo Area FPGA & PCB Team FPGA development boards, PCB samples, packaging examples, design review artifacts
Slot 2 2:30 PM – 3:00 PM
BatchLocationTour LeadCoverage
Batch A ATE Lab ATE Team Automated testing and production validation
Batch B Engineering Interaction Zone / Demo Area FPGA & PCB Team FPGA demonstrations, PCB realization examples
Batch C Reliability Lab Reliability Team Qualification and reliability testing
Slot 3 3:00 PM – 3:30 PM
3:15 – 3:25 PM Reconvene at Main Hall
3:25 – 3:30 PM Workshop Wrap-up, Feedback Collection & Group Photograph