De-risk your chip with Tessolve’s full silicon bring-up support. Expert labs for PCIe Gen 6/7, LPDDR5/6, SerDes characterization, and HPC chip validation.
About Tessolve
22+ years of proven expertise across advanced process nodes, ATE platforms, and semiconductor protocols
Tessolve delivers end-to-end test engineering services across the complete post-silicon validation lifecycle, from ATE program development and device characterization to wafer sort services and system-level testing. Supporting digital, analog, mixed-signal testing, RF, and sensor devices, we have delivered 900+ successful test programs backed by an advanced semiconductor test lab featuring Advantest V93000 and Teradyne UltraFlex. Our integrated approach ensures a seamless transition from silicon bring-up services to high-volume production test services, enabling quality, scalability, and faster time-to-market.
End-to-end Post-Silicon Validation Capabilities
Comprehensive engineering test services spanning silicon bring-up, ATE test solutions, wafer
sort testing, device characterization, and system-level testing—delivered by an
experienced team of test and validation engineers.
Digital
Expert high speed digital validation for FPGAs, SoC FPGAs, 32-bit DSPs, microprocessors, and high-speed logic ASICs. Includes HSIO compliance and margin analysis for PCIe Gen 6/7, DDR5/LPDDR5X/6, and CXL.
Analog Power &
Automotive ASICs
Expert automotive grade ic testing and qualification services for AFE modules, op-amps, and amplifiers. We provide turnkey semiconductor testing for audio, video, and MIPI switch-based devices.
Mixed Signal IC
Characterization
Mixed signal IC characterization services including 16-bit and 24-bit ADCs, DACs, Power Architecture® processors, and PLLs. Supports multi-channel sigma-delta ADCs with a focus on ic testing accuracy, performance, and hardware integration.
RF/mm-Wav
Advanced RF characterization services for 5G, Bluetooth, WLAN, RADAR, and mobile transceivers. Our RF test engineers specialise in beamformers, antenna switches, LNAs, and RF HTOL and reliability testing for automotive chips.
Sensors
Comprehensive ic testing and validation services for high-speed image sensors (line scan and area scan) and MEMS-based devices. Supports LiDAR, RADAR, and automotive-grade sensors with focus on precision and reliability.
ATE Platforms & Lab Infrastructure
Advanced semiconductor test lab infrastructure across multiple locations, powered
by Advantest V93000 (exascale) test program development and Teradyne UltraFlex ATE platforms.
Elevate your post-silicon validation
with our expert ATE test solutions.
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Why Tessolve ?
From fabless startups to global IDMs, our engineers bring deep silicon expertise alongside the infrastructure to move fast without compromising quality.
Validation Expertise Across Every Vertical
Specialized automotive grade IC testing and high-speed digital validation
across diverse markets
