|Conference:||DVCLUB Europe | Using ML and AI in EDA Tools|
|Speaker:||Yassine Eben Aimine, Field Applications Engineer, OneSpin: A Siemens Business.|
|Abstract:||Both ML and AI technologies can bring about a new wave of semiconductor chip design and verification productivity. Being the centre piece for software tooling, EDA stands to benefit significantly from these technologies.
This presentation will start with a short survey of ML and AI techniques encountered in the semiconductor industry. We will then look at how OneSpin products, through their use cases for formal verification, deploy some of these techniques to provide performance and capacity improvements in property convergence and regression optimization. We will conclude this talk by identifying new areas of automation where AI can significantly help shorten ASIC/FPGA verification cycles.3 Key Points:
|Speaker Biography:||Yassine has more than 20 years’ experience in the EDA industry. Throughout his professional career, Yassine has partnered with design and verification engineers to deploy the latest technologies in EDA tooling in the areas of design for test, functional verification, and functional safety.|
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