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Brochure/Newsletter

First Bin July 2021 Edition – A Newsletter for the Semiconductor Engineering Community

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We are glad to announce the release of the July-21 edition of our Newsletter, First Bin. Kudos to our Newsletter teams, all the contributing authors, and the technical committee members for doing a great job in bringing out this July 2021 edition!

Overview of VLSI – Physical Design capability

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Motivated team, better design capability

Rich and extensive Physical Design (PD) experience has enabled the team to work on multiple successful tape-outs. Expertise with all Industry standard EDA tools, Design Flow and well trained to handle low power, high performance area critical designs.

Evaluation Board for i.MX6 SMARC Module

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Tessolve’s MAGIK-2 family of platform comprises various COM (Computer-on-Module) products as well as application specific carrier cards and associated software packages.

M2-SM8M-xx – i.MX8M based SMARC Module

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Using the SMARC standard 2.0 for embedded modules, TESSOLVE EMBEDDED SYSTEMS introduces an ultra-low power ARMCore based SOM (System-On- Module) powered by NXPTM i.MX8M Family processor which has a quad ARM Cortex A53 CPUs.

Design for Test/ Debug (DFT/DFD)

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Our team of Design for Testability experts can help increase IC test coverage, yields and quality.

Design for Testing (DFT) and Debugging (DFD) are critical stages in the micro-architectural phase of a design. Working in tandem with a client’s design team, our experts understand the structure of the chip which enables them to create the complete DFT and DFD architecture.

How to choose the right Performance Testing tool?

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To choose the right performance testing tool is the first and foremost requirement in
the planning phase. After understanding the application architecture and business requirements, you have to select the performance testing tool which meets the performance objectives.

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Find out how Tessolve software Testing services help you to solve issues in a cost-effective way and deliver with high quality

Analog & Mixed Signal (AMS) Design

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Executing Turnkey Projects – Ownership from Spec to GDS to Silicon

Analog and Mixed signal design team at Tessolve specializes in High quality design for different applications with process nodes varying from 350nm to most advanced 5nm designs.

How AI and IoT will continue to transform business landscapes in 2020

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IoT especially, is viewed as a key enabler, driving digital transformation to unlock operational efficiencies. Artificial Intelligence (AI), coupled with ubiquitous connectivity, is enabling exponential value being generated by IoT.

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Find out how Tessolve IoT services help to build a foundation of trust, security and safety in the industrial IoT devices.

MEDIATEK MT8385 (i-500)based System on Module

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TESSOLVE introduces ultra-low power SOMs (System-On-Module) based on the MEDIATEK i500 Family which integrates Quadcore Arm Cortex-A53 and Quadcore Arm Cortex-A73 equipped with NEON engines operating at 2GHz.

Evaluation Board – i500 Nano SoM

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TESSOLVE introduces Evaluation board based on the MEDIATEK i500 Family of processors which integrates Quadcore Arm Cortex-A53 and Quadcore Arm Cortex-A73 equipped with NEON engines operating at 2GHz.