09-11 June 2026  

Tessolve will be present at AutoSens USA & In-Cabin USA 2026, engaging with global innovators in ADAS, autonomous vehicles, and in-cabin monitoring. Held in Detroit – the global hub of automotive engineering, this premier event is a strategic platform for Tessolve to showcase its expertise in automotive semiconductor validation and AI-driven sensing solutions.

Event details:

  • Event Name: AutoSens USA & In-Cabin USA 2026
  • Date: 09-11 June 2026
  • Location: Huntington Place, Detroit, USA