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March 5-7 2025

Tessolve, a Silicon Sponsor at IESA Vision Summit 2025, will showcase expertise in advanced packaging and embedded technologies. Visit our booth to explore our cutting-edge solutions and connect with our experts.

Check the event details below:

  • Event Date: March 5th–7th, 2025
  • Booth Number: 13, 14 & 15
  • Location: Mahatma Gandhi Mandir, Gujarat
  • Focus Areas: Advanced Packaging & Embedded Technologies
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