Tessolve Highlights Test Engineering Practices, Participating At The ITC India 2019 As Platinum Sponsors

By July 31, 2019News/Press Releases

Tessolve, a leading semiconductor engineering service partner, was an integral part of the 2019 chapter of ITC (International Test Conference) India, at the Leela Palace, Bengaluru between July 21-23. Partnering as a Platinum Supporter, the company played a significant part in the expo.

The booth highlighted the latest 5G offerings and automotive touchpoint transformation with test engineering practices. The space also featured our capabilities – FA & Reliability infrastructure and engineering team expertise and provided a glimpse of the 15 years of our success story. Throughout the two-day conference, the team also exhibited products demos of the various test, system design, and embedded engineering modules. The outcome was an engaging booth with a continued influx of visitors including various key stakeholders of different companies, faculties, and students from colleges/universities.

Mr. P Raja Manickam, Tessolve’s Founder and CEO, also attended the event, as he shared the stage with Janusz Rajski, VP Engineering at Mentor Graphics, presenting a memento to him. He also introduced Mike Campbell, the Senior VP of Qualcomm and a keynote speaker at the conference.

The Test Engineering team also participated in the event, sharing their experiences about ATE Load-boards. Team experts Jagadish Kumar Chandrasekaran (Sr. Director Test Engineering), Srinivasan C (Sr. Manager, Test Engineering), and Gowri Shankar Ilankumaran (Sr. Test Engineer) engaged the audience in a 3 and a half-hour of an interactive tutorial session, on Sunday, July 21st. Besides this, there was another interesting session from Sudhakar Babu (Sr. Manager, Test Engineering) about mmWave Test Solution, on 22nd July during the Conference.

Overall, the team was excited with the positive impression made at the International Test Conference with three amazing and insightful days.

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