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20s Yesrs Success 1

We Believe

Where there’s a possibility, there’s a product

Productization of next-gen Semiconductor products, from Design to Silicon and Systems, by constant innovation and technical competence. At Tessolve semiconductor, chip designing, and embedded solutions company, we take pride in our ability to seamlessly integrate design, and test engineering processes, embedded systems allowing us to help our customer to bring new products while minimizing costs and maximizing performance. Driven by almost two decades of engineering success, the products are brought to life by the era.

Where there’s a possibility, there’s a product

Numbers telling our growth story

2004
Till Date - MultipleChips Transformed
3000
Rising Team of
Experts to
900
Test Program
Released
130
PCB Designs Per
Month
35
Products

Between Possibilities And Products

Pillars of expertise become the bridge

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Tessolve roadmap

Embedded within these milestones is our people expertise – technologists, innovators, and thought leaders leading every engagement from a silicon-first perspective.

Industries We’ve Partnered With

Our footprints in their silicon/systems led success

Values Delivered On The Way

People, tech, and transparency to weave a difference

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Our COE programs productize cutting-edge tech – advancing product innovation possibilities
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Uniquely positioned to lead customers from idea to final product on years of silicon engineering and embedded expertise.
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Transparency on what really works, rather than just implementing ensures consistent quality in every product.
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End-to-end Capability to manage the infrastructure – foundry, back-end assembly, and supply chain.

Spectrum Of Offerings

Converging pre-silicon to post-silicon and turnkey expertise

ASIC Design

Innovative semiconductor design services encompassing RTL Design, DV, Emulation, FPGA, Physical design, DFT, etc., with the ability to seamlessly transition from design to development to production. With a strong focus on quality, reliability, and cost-effectiveness, Tessolve delivers cutting-edge ASIC Design solutions for various applications such as AI, IoT, automotive, and more that meet the diverse needs of customers.

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Package Engineering

Expediting package engineering research and design roadmaps while ensuring cost optimizations for clients. Using advanced design tools and methodologies, Tessolve company’s package engineering team helps customers optimize their packaging solutions’ performance, reliability, and cost.

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Post Silicon Support

A comprehensive post-silicon service continuum that includes test engineering, product engineering, and validations, ensuring faster time-to-market. Tessolve services for post-silicon support are designed to help semiconductor companies bring their products to market promptly.

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PCB Design

we specialize in delivering comprehensive PCB solutions, covering schematic design to fully assembled boards. Our expertise extends to advanced silicon hardware engineering, encompassing PCB design, development, and efficient delivery.

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Turnkey
Development

Our end-to-end product design services offer comprehensive solutions encompassing the entire process from concept development to manufacturing, ensuring a seamless and efficient journey for embedded hardware.

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SOM & EVK

Our expertise lies in designing advanced embedded systems, providing smarter, smaller, and more sophisticated solutions. Through our SOM and EVK services, we enable cutting-edge technology development for embedded solutions.

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Embedded Design

Tessolve provides end-to-end product design services in the embedded design solution domain, encompassing the entire journey from concept development to manufacturing.

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The World Of Tessolve

Built on engineering expertise, furthered by innovative minds

19+ years since inception, Tessolve company has become one of the most-trusted semiconductor, chip design, and embedded solutions companies, made possible through our people. We are an open hub, allowing Tessolvians to challenge, innovate, and create – VIBE without any boundaries.
Our commitment to engineering expertise and innovative thinking has enabled us to stay at the forefront of the industry and provide our clients with cutting-edge solutions that meet their evolving needs. At Tessolve, we are proud of our legacy and excited about the possibilities of the future.

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Veracity in every
action we plan

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Innovative mindset to
think out of the box

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Bold in taking necessary
tough decisions

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Empathy for all
(peers, partners, clients)

Brands We Helped

Engineering their “Needs” to “Next-gen Solutions”

Our Space Of Updates

A trove of the latest highlights and thought leadership

ITC test week India 2022
News/Press Releases
Tessolve showcased state-of-the-art Test Engineering Practices and more; Participated as a gold sponsor at the ITC India 2022 conference
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Thought leadership
IoT – The Fuel for Autonomous and Connected Vehicles
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Events
International Test Conference (ITC) – India 2022
System on Modules (SoM)
Research Projects
Five Reasons to Use System on Modules (SoM) in Embedded System Design
Importance of VLSI Design Ecosystem in India
Blogs
Increased Importance of VLSI Design Ecosystem in India for Worldwide Semiconductor Industry

Thinking Of A Possibility?
Let’s Ensure There’s A Product

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