Tessolve Embedded Systems
Ahead of the current innovation curve
Tessolve offers end-to-end product design services in the embedded domain from concept-to-manufacturing under an ODM model with experience in multimedia products in Avionics, Automotive, Industrial and Medical. Tessolve’s solution includes system design, hardware and mechanical development, BSP and firmware development, Middleware integration, third party application integration, application development, testing and validation, production management and product cycle support. Tessolve delivers value by customizing the platform, including HMI and mechanical enclosure and through an EN9100 certified process.
Product Engineering Services Overview
Tessolve is the market leader in providing product engineering services across the globe. Tessolve’s Embedded Engineering services enables customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world class lab facilities. Our Embedded team helps our clients to develop, design, productize, and maintain advanced, smarter & sophisticated Embedded Systems. As a product engineering service provider, Tessolve’s embedded product engineering service portfolio includes Semiconductor engineering, Wireless Testing, Turnkey product Development, software enablement on Chip from systems to cloud, testing and validation, manufacturing, and post manufacturing product life cycle support. Tessolve allows customers to leverage high end engineering in a cost optimized model by being able to scale teams to meet exact customer needs.
Semiconductor Engineering Services
- Focused on high-end video, audio, and multimedia embedded system
- ISO9001 & EN9100 Quality certified
- A passionate team of 100+ engineers!
- Proven track record of 30+ products delivered to customers in ODM Model
- Connected: Located in Bangalore the Indian Silicon Valley
- Local sales and Program Management in Europe & US
Wireless Protocol Stack Integration & Testing
Over the last decade, the wireless communications market has grown significantly with devices required to undergo effective wireless testing to ensure they perform correctly and are reliable, safe, and secure.
The Tessolve Wireless Protocol Stack Integration and Testing Services help to identify the issues through a low-cost process within the specified time. These services improve the quality of the product and hence contribute to the development of the wireless communications which has become an important part of the future societies. Tessolve is well placed to address the growing LTE-A and 5G market.
Turnkey Development Services
Product Design Services
End-to-end product design services from concept-to-manufacturing
Tessolve offers end-to-end product design services in the embedded domain from concept-to-manufacturing under an ODM model with experience in multimedia products in Avionics, Automotive, Industrial, Medical & Wearable Devices and IoT.
Service offerings: System Design to Manufacturing
Tessolve’s solution includes system design, Hardware and mechanical development, BSP and firmware development, Middleware integration, third party application integration, application development, testing and validation, production management and product cycle support. Tessolve delivers value by customizing the platform, including HMI and mechanical enclosure and through an EN9100 certified process. Over the past years Tessolve has provided complete end-to-end embedded development services that has enabled customers commercially deploy more than 30+ products. Tessolve’s partners with Original Equipment Manufacturers and product development companies as an engineering solution partner to provide HW/SW/System services and solutions to customers.
Our in-house IoT Bricks and custom development with excellent solution engineering capabilities help solution providers and product developers with end-to-end design, development and qualification needs. Cost-effective engagements with multi-domain expertise ensure that products are launched with faster time-to-market.
The Tessolve Cloud-Ready-Solutions have been tailored to help organisations quickly and effectively adopt proven, fully tested cloud-based computing to help stay competitive.
Our expertise and experience ensures that we match system requirements with the right cloud architecture and help in cloud migration and integration
System Integration Capabilities
Implementing cost-effective system integration solutions that are fully tested, proven and secure
At Tessolve, we drive growth in silicon engineering utilizing our robust framework of hardware support services. We design, develop and simulate every piece of Hardware necessary for Embedded Systems.Our Hardware Engineering capabilities include Design, Simulations, Analysis, EDA Tools, Prototyping And Manufacturing, Testing and Validations.
Our software solutions allow us to leverage the expertise we have built in semiconductors across other industries and provide solutions for software support necessary for chip design, system level test and embedded systems
The Tessolve software testing teams are proficient in the latest testing methodologies and test automation tools, as well as a wide range development processes such as Agile and V-model.
We help you with Accessibility Testing, Automation Testing, IoT Testing, Simulation Testing, etc,.