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Tessolve is recognized and featured by SiliconIndia among The 10 Best Electronics Companies to Work For in Bangalore 2021.

By | News/Press Releases

We are thrilled to share another milestone to Tessolve’s journey with the recognition Tessolve has achieved by SiliconIndia among The 10 Best Electronics Companies to Work For in Bangalore 2021.

Explore here to know more about this prestigious recognition and see Tessolve featuring in the listing on SiliconIndia’s website. Click here to view the article featuring Tessolve, honorable CEO Srini Chinamilli has shed some insight about Tessolve creating & sustaining a winning workplace culture and how our company has earned excellent credibility in the Semiconductor engineering space.

PCB West 2021 Conference and Exhibition

By | Events | No Comments

On 5th October, join us at the 2021 edition of PCB West at the Santa Clara Convention Center, California. A leading conference for the design and fabrication of Printed Circuit Boards, the event will assemble design engineers, expert fabricators, and assemblers.Join us at the event between October 5 – 8, 2021 as we elaborate advances in design and fabrication of PCBs for new-age applications in high-reliability and high-performing electronics.

More Details
PCB West 2021
Booth Number: 417
5-8 October
Santa Clara Convention Center
California

Changes in Global Chip Supply Chain Driving Demand for Technology Porting

By | Thought leadership

In the past year and a half, COVID has impacted the semiconductor industry, disrupting the supply chains. These supply chain disruptions have compelled organizations to review their silicon supply strategy and consider foundry technology porting to overcome chip shortages and build resilient supply chains.

Read this blog to explore Tessolve’s extensive expertise in porting multiple designs, making it your preferred fab switching partner.

First Bin July 2021 Edition – A Newsletter for the Semiconductor Engineering Community

By | Brochure/Newsletter | No Comments

We are glad to announce the release of the July-21 edition of our Newsletter, First Bin. Kudos to our Newsletter teams, all the contributing authors, and the technical committee members for doing a great job in bringing out this July 2021 edition!

System Level Testing – The Differentiator

By | Thought leadership

System-Level Test (SLT) for Volume is one of the Centers of Excellence (COE) initiatives that Tessolve had taken in the Test Business Unit (BU). In this blog, we caught up in a candid conversation with Yogan Senthilkumar, VP of Engineering Tessolve an industry veteran, who has been instrumental in heading multiple teams in R&D, Test engineering, and PCB divisions at Tessolve and played a pivotal role in building the SLT solution for Tessolve.

Read this blog to explore more about SLT, key trends, the differentiator from traditional testing, customer challenges, Tessolve’s SLT solution, competitive advantage for customers, and more.

Tessolve joins the Arm approved Design partner program to accelerate time to market for product development

By | News/Press Releases

Tessolve is now a member of the Arm® Approved Design Partner program, a global network of product design service companies endorsed by Arm.
Tessolve’s strategic partnership with ARM aims at accelerating time to market for product development and paves a way to explore new avenues of semiconductor design! Read the full PR article here:

https://www.crn.in/news/tessolve-joins-the-arm-approved-design-partner-program-to-accelerate-time-to-market-for-product-development/

Tessolve in collaboration with InCore Semiconductor brings to you an open-source RISC-V Core verification tool – RiVer Core

By | Blogs, Thought leadership | No Comments

RiVer Core is a python based extensible and scalable framework aimed at providing a central control point for all major aspects of a RISC-V processor verification flow. The tool is fully open source under the permissive BSD-3 Clause License.
Read this blog to explore more about RiVer Core framework, the major components, its holistic approach and its advantages.

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Tessolve expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam to accelerate Tessolve’s ability to provide value to customers globally. Today, though Tessolve offers its solutions across the globe, we see a need for a more integrated approach while supporting our emerging technologies’ customers. We truly become an extended arm of their engineering teams, collaborating from the design drawing board to managing their product orders.

Tessolve raises $40 million from Singapore-based PE firm Novo Tellus

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces that leading Singapore based PE firm Novo Tellus Capital Partners has invested $40M in Tessolve.

Tessolve intends to use this additional fund for acquisitions and investments in key areas of growth and expansion of the business. Besides, this investment provides Tessolve a significant opportunity to accelerate the growth of its Chip Design and ASIC engineering capabilities and further strengthen its global footprint.

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Tessolve Semiconductor is now a certified IPC member

By | News/Press Releases | No Comments

We are proud to announce that Tessolve Semiconductor Pvt. Ltd. is now an IPC member facility. The IPC membership is mainly focused on electronic interconnect industries & brings together the PCB designers, PCB Fabrication, PCB Assembly, Suppliers & OEM’s. And it facilitates members with training, market research, public policy advocacy and extended services.

With the recent membership certification from IPC, the credibility of our PCB design and related competencies has gained a remarkable advantage. This is another step to reaffirm the quality of our PCB Design & Development under Tessolve Offerings.

Tessolve expands its Japanese operations as part of an international expansion plan to capitalize on its VLSI and Embedded business

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces its expansion of Japanese operations indicating its global expansion strategy to drive international revenue growth.

It is almost 5 years since Tessolve has been operational in the Japanese market, one of the high potential global economies. This provides Tessolve an opportunity to expand its business in new territory and focus on VLSI and Embedded business. Besides, Tessolve’s Japanese operations are expected to target various industry markets like Automotive to avionics, consumer electronics to medical and the company’s business operations plans for tomorrow’s customer in 5G, Autonomous driving, Artificial Intelligence, and Virtual Reality.

Recently Tessolve has broadened the Japanese operations through the addition of highly skilled and experienced local Professionals in the progress and execution of business. Hitoshi Eda, Senior Manager, Program Management has joined Tessolve to act as a technical bridge between Japanese customers and the Tessolve engineering team. This expansion strategy will surely help Tessolve to differentiate its service offering and empower its team to engage with clients.

Tessolve Launches Edge Artificial Intelligence (AI) Integrator to build new Intelligent Solution

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, has announced a new Edge AI Integrator solution to transform customer’s connected products into new smart products and solutions.

The powerful combination of the Tessolve AI integrator and IoT offerings can support customers from various industries such as avionics, automotive, industrial and medical markets to build more intelligent solutions from their data.

Our Edge AI solution is the brain behind the IoT body parts to create new smart products and solutions or enhance existing products & services. 

The new edge AI integrator solution can be tailored to customer’s requirements and thus help organizations to augment innovation capabilities, increase working efficiency, improve cybersecurity, and enhance customer experience.

Tessolve is providing the advanced hardware and software capabilities, and the multi-standard connectivity required in the end-to-end IoT business solutions such as predictive maintenance for Industry 4.0, smart metering, enhanced vision systems & consumer products, asset management, …

If you want to find out more, please contact:

David Mudard

Senior Sales Manager – Embedded Systems
Tel: +33 (0) 428-290-800
Mobile: +33 (0) 637-303-732
Email: david.mudard@tessolve.com

Overview of VLSI – Physical Design capability

By | Brochure/Newsletter | No Comments

Motivated team, better design capability

Rich and extensive Physical Design (PD) experience has enabled the team to work on multiple successful tape-outs. Expertise with all Industry standard EDA tools, Design Flow and well trained to handle low power, high performance area critical designs.

In-house Tool for Performance Testing

By | Blogs, Thought leadership | No Comments

In the software development cycle, testing is one of the important criteria. There are many tools available in this space for testing such as Junit, Jmeter, manual, automation, and many performance testing tools.

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Find out how Tessolve Software Testing services help you to establish a cost-effective software testing facility that delivers improved quality, reduces risks and time-to market.

Tessolve Digitizes the Complete Operations for Kaapi Machines

By | News/Press Releases | No Comments

We are pleased to announce that the Tessolve Embedded team has Collaborated with Kaapi machines in successfully enabling IOT integration of a commercial coffee vending machine.

The scope of the digitization includes secured contactless coffee dispensing; machine onboarding; beverage management; user management and analytics on consumption.

This solution impacts the full ecosystem: end-users have the safety of contactless dispensing; improved cost management and analytics and efficient management of machines for Kaapi.

Tessolve has created an easy-to-use mobile application for end-users, a desktop application for facility managers and suppliers, and an application for installation and machine onboarding. This is completely digitized and integrated with Tessolve’s IoT framework and customized business logic layer for Kaapi

Tessolve digitization offers a ready-to-use IoT framework comprising connectivity, devices, data, dashboard, and AI which can help in quickly digitizing your business for operational excellence through automation.

For more information please contact:

Satyam Trivedi
Director Engineering IoT Embedded Systems
Tel: + 91 80 66995800
Mobile: 9739536984
Email: satyam.trivedi@tessolve.com

Evaluation Board for i.MX6 SMARC Module

By | Brochure/Newsletter | No Comments

Tessolve’s MAGIK-2 family of platform comprises various COM (Computer-on-Module) products as well as application specific carrier cards and associated software packages.

M2-SM8M-xx – i.MX8M based SMARC Module

By | Brochure/Newsletter | No Comments

Using the SMARC standard 2.0 for embedded modules, TESSOLVE EMBEDDED SYSTEMS introduces an ultra-low power ARMCore based SOM (System-On- Module) powered by NXPTM i.MX8M Family processor which has a quad ARM Cortex A53 CPUs.

Analog Devices Inc. Recognizes Tessolve At Supplier Day Awards 2020

By | News/Press Releases | No Comments

2020 adds another milestone to Tessolve’s journey with the recognition as the Best in Service and Responsiveness Emerging Supplier Award, supported by its competent engineering team. The accolade was announced at the second edition of the Analog Devices Supplier Day Awards 2020, celebrating the commitments and exemplary performances of ADI partners in established, emerging, and niche categories.

Tessolve was recognized for its outstanding support and contribution to ADI’s success during the past year and bagged the award under the ‘Best in Service and Responsiveness for Emerging as a Niche Supplier’ criteria.

To know more about this prestigious recognition, follow the comments of Steve Lattari, Senior Vice President, ADI Global Operations and Technology, announcing Tessolve as the winner.

Design for Test/ Debug (DFT/DFD)

By | Brochure/Newsletter | No Comments

Our team of Design for Testability experts can help increase IC test coverage, yields and quality.

Design for Testing (DFT) and Debugging (DFD) are critical stages in the micro-architectural phase of a design. Working in tandem with a client’s design team, our experts understand the structure of the chip which enables them to create the complete DFT and DFD architecture.

Tessolve Joins The STMicroelectronics Partner Program As An Engineering Solution Partner

By | News/Press Releases | No Comments

Tessolve has forged another significant partnership leveraging its advanced engineering capabilities and end-to-end product design services in the embedded domain. Recently, we were recognized as an Engineering Solution Partner by STMicroelectronics – a leading semiconductor manufacturer delivering energy-efficient products.

Joining the robust partner program of STMicroelectronics, Tessolve is now listed as a partner and has been featured on its dedicated partner page. The company is poised to provide Hardware/Software/System services and solutions (based on processors, mems, sensors, applications, etc.), furthering the capabilities of original equipment design, manufacturing, and qualification.