All Posts By

Admin

Tessolve Showcases Advanced Product Engineering at the SemiconIndia 2022 Conference.

By | News/Press Releases

Tessolve participated at the SemiconIndia 2022, the post-COVID gigantic conference in the Semiconductor industry. The Hon’ble Prime Minister of India, Shri Narendra Modi, inaugurated the conference via Video Conference on 29th April 2022 to make India a global hub for Semiconductor Design, Manufacturing, and Technology Development.

At the event booth, Tessolve highlighted the story of defining engineering success end to end through Design Test & Production. In meaningful conversations, the embedded team participating at the event demonstrated Tessolve’s Product Engineering service and IoT offerings on Industrial, Connected Cars, Smart Lighting, IoT Bricks-Sensors, Connectivity Modules, and Gateway. Our engineering team has displayed our Load boards and the various embedded products interestingly with appropriate brochures. We had visitors from Startups, Academia, and Global Industry Leaders to learn more about Tessolve, our services portfolio, and our role in the latest technologies.

Tessolve Strengthens Its Leadership Team With the Appointment of Huzefa Cutlerywala as SVP of Sales and Marketing and Madhav Rao as SVP VLSI Design

By | News/Press Releases

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and system companies, is pleased to announce the appointment of two industry veterans, Huzefa Cutlerywala as Senior VP of Worldwide Sales and Marketing, and Madhav Rao as Senior VP VLSI Design.

Read the full PR article here:

https://www.businesswire.com/news/home/20220413005466/en/Tessolve-Strengthens-Its-Leadership-Team-With-the-Appointment-of-Huzefa-Cutlerywala-as-SVP-of-Sales-and-Marketing-and-Madhav-Rao-as-SVP-VLSI-Design

Tessolve inaugurates the Test Engineering Lab in the heart of Silicon Valley San Jose on Mar 23, 2022

By | News/Press Releases

Tessolve announces its inaugural run of its Test Engineering Lab in San Jose on Mar 23. We offer access to test engineering and program development experts and access to testers. Our lab will be designed and equipped with test instruments:

  • Advantest, 93k Smartscale STH, and CTH configurations
  • Advantest, 93k Exascale CX
  • Teradyne, ETS 364
  • Chroma, MPVI
  • Semic, Opus 3 Tri Temp Prober
  • Seiko Epson Handler
  • Chroma Handler
  • Thermostream
  • and standard diagnostics equipment

First Bin – A Newsletter for the Semiconductor Engineering Community, Issue Jan 2022

By | News/Press Releases

We are glad to announce the release of the Jan 22 edition of our Newsletter, First Bin.

The newsletter contains a note from our CEO’s Desk, Tessolve Showcase article, and Tessolve Challenge Case Study. Thanks to all the contributing authors and the technical committee members.

To know more, please download the Newsletter:

https://www.tessolve.com/wp-content/uploads/2022/02/Tessolve_FIRST-BIN_A.pdf

Tessolve collaborates with DynamoEdge to introduce innovative TERA drA.I.ve

By | News/Press Releases

Tessolve’s and DynamoEdge have announced a partnership to deliver the fastest end-to-end mobility solutions powered by AT&T 5G. The strategic collaboration of Tessolve with DynamoEdge has paved the way to deploy Real-Time AI analytics software (drA.I.ve) on our Automotive Service Gateway platform (TERA).

Read the full PR article here:

https://www.business-standard.com/content/press-releases-ani/tessolve-and-dynamoedge-introduce-tera-dra-i-ve-122021501039_1.html

Download the brochure for NXP S32G2 SMARC SoM

Tessolve Datasheet NXPS32G2

Design Automation Conference 2021

By | Events | No Comments

Join us at the 58th Design Automation Conference (DAC) in San Francisco, between December 5-9, 2021.
DAC, a premier conference for the design and automation of electronic systems, the event will bring together researchers, designers, practitioners, tool developers, students, and vendors. The 58th DAC focuses on the latest methodologies and technology advancements in electronic design.
At Tessolve, we would participate at DAC with leading EDA, design on the cloud, and IP companies.

More Details
Design Automation Conference (DAC) 2021
Booth Number: 2448
December 5-9, 2021
San Francisco

Tessolve is now a Worldwide PDH (Preferred Design House) Partner of Infineon to provide Customer technical support and HW/SW design services on Infineon solutions portfolios such as AURIX™ Microcontrollers and related topics.

By | News/Press Releases

The partnership will allow showcasing our end-to-end capabilities in supporting Industrial and Automotive OEM’s safety-related Hardware modules, associated Software technology, innovative Automotive product development, and system validation for various customers across the globe. This strategic association will enable Infineon through Tessolve to provide 24-hrs response time to the customer by email and/or phone to AURIX™, Traveo II™, AUTO PSoC-related inquiries.

Moreover, Tessolve’s expertise & Infineon product synergy will extend technical help and advice on the Infineon solutions, Tessolve supports HW/SW Engineering to achieve optimal and effective performances and paves a way to explore new avenues for the design of ADAS / Radar / Motor Control / Lighting system. Check out the link to know more about this partnership.

Tessolve – Infineon Technologies

Tessolve Joins GlobalFoundries’ Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development

By | News/Press Releases

Tessolve has joined the GlobalFoundries® (GF®) Design Enablement Network Program. The strategic partnership with GF aims to bring state-of-the-art design solutions across multiple end markets including automotive, industrial, server, graphics, and mobile platforms. Read the full PR article here:

https://www.businesswire.com/news/home/20211103005510/en/Tessolve-Joins-GlobalFoundries%E2%80%99-Design-Enablement-Network-Program-as-a-Design-Partner-to-Bring-Advanced-Design-Solutions-to-Accelerate-Customer-Product-Development

Tessolve is recognized and featured by SiliconIndia among The 10 Best Electronics Companies to Work For in Bangalore 2021.

By | News/Press Releases

We are thrilled to share another milestone to Tessolve’s journey with the recognition Tessolve has achieved by SiliconIndia among The 10 Best Electronics Companies to Work For in Bangalore 2021.

Explore here to know more about this prestigious recognition and see Tessolve featuring in the listing on SiliconIndia’s website. Click here to view the article featuring Tessolve, honorable CEO Srini Chinamilli has shed some insight about Tessolve creating & sustaining a winning workplace culture and how our company has earned excellent credibility in the Semiconductor engineering space.

PCB West 2021 Conference and Exhibition

By | Events | No Comments

On 5th October, join us at the 2021 edition of PCB West at the Santa Clara Convention Center, California. A leading conference for the design and fabrication of Printed Circuit Boards, the event will assemble design engineers, expert fabricators, and assemblers.Join us at the event between October 5 – 8, 2021 as we elaborate advances in design and fabrication of PCBs for new-age applications in high-reliability and high-performing electronics.

More Details
PCB West 2021
Booth Number: 417
5-8 October
Santa Clara Convention Center
California

Changes in Global Chip Supply Chain Driving Demand for Technology Porting

By | Thought leadership

In the past year and a half, COVID has impacted the semiconductor industry, disrupting the supply chains. These supply chain disruptions have compelled organizations to review their silicon supply strategy and consider foundry technology porting to overcome chip shortages and build resilient supply chains.

Read this blog to explore Tessolve’s extensive expertise in porting multiple designs, making it your preferred fab switching partner.

First Bin July 2021 Edition – A Newsletter for the Semiconductor Engineering Community

By | Brochure/Newsletter | No Comments

We are glad to announce the release of the July-21 edition of our Newsletter, First Bin. Kudos to our Newsletter teams, all the contributing authors, and the technical committee members for doing a great job in bringing out this July 2021 edition!

System Level Testing – The Differentiator

By | Thought leadership

System-Level Test (SLT) for Volume is one of the Centers of Excellence (COE) initiatives that Tessolve had taken in the Test Business Unit (BU). In this blog, we caught up in a candid conversation with Yogan Senthilkumar, VP of Engineering Tessolve an industry veteran, who has been instrumental in heading multiple teams in R&D, Test engineering, and PCB divisions at Tessolve and played a pivotal role in building the SLT solution for Tessolve.

Read this blog to explore more about SLT, key trends, the differentiator from traditional testing, customer challenges, Tessolve’s SLT solution, competitive advantage for customers, and more.

Tessolve joins the Arm approved Design partner program to accelerate time to market for product development

By | News/Press Releases

Tessolve is now a member of the Arm® Approved Design Partner program, a global network of product design service companies endorsed by Arm.
Tessolve’s strategic partnership with ARM aims at accelerating time to market for product development and paves a way to explore new avenues of semiconductor design! Read the full PR article here:

https://www.crn.in/news/tessolve-joins-the-arm-approved-design-partner-program-to-accelerate-time-to-market-for-product-development/

Tessolve in collaboration with InCore Semiconductor brings to you an open-source RISC-V Core verification tool – RiVer Core

By | Blogs, Thought leadership | No Comments

RiVer Core is a python based extensible and scalable framework aimed at providing a central control point for all major aspects of a RISC-V processor verification flow. The tool is fully open source under the permissive BSD-3 Clause License.
Read this blog to explore more about RiVer Core framework, the major components, its holistic approach and its advantages.

Read More

Tessolve expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam to accelerate Tessolve’s ability to provide value to customers globally. Today, though Tessolve offers its solutions across the globe, we see a need for a more integrated approach while supporting our emerging technologies’ customers. We truly become an extended arm of their engineering teams, collaborating from the design drawing board to managing their product orders.

Tessolve raises $40 million from Singapore-based PE firm Novo Tellus

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces that leading Singapore based PE firm Novo Tellus Capital Partners has invested $40M in Tessolve.

Tessolve intends to use this additional fund for acquisitions and investments in key areas of growth and expansion of the business. Besides, this investment provides Tessolve a significant opportunity to accelerate the growth of its Chip Design and ASIC engineering capabilities and further strengthen its global footprint.

Know More

Tessolve Semiconductor is now a certified IPC member

By | News/Press Releases | No Comments

We are proud to announce that Tessolve Semiconductor Pvt. Ltd. is now an IPC member facility. The IPC membership is mainly focused on electronic interconnect industries & brings together the PCB designers, PCB Fabrication, PCB Assembly, Suppliers & OEM’s. And it facilitates members with training, market research, public policy advocacy and extended services.

With the recent membership certification from IPC, the credibility of our PCB design and related competencies has gained a remarkable advantage. This is another step to reaffirm the quality of our PCB Design & Development under Tessolve Offerings.

Tessolve expands its Japanese operations as part of an international expansion plan to capitalize on its VLSI and Embedded business

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, announces its expansion of Japanese operations indicating its global expansion strategy to drive international revenue growth.

It is almost 5 years since Tessolve has been operational in the Japanese market, one of the high potential global economies. This provides Tessolve an opportunity to expand its business in new territory and focus on VLSI and Embedded business. Besides, Tessolve’s Japanese operations are expected to target various industry markets like Automotive to avionics, consumer electronics to medical and the company’s business operations plans for tomorrow’s customer in 5G, Autonomous driving, Artificial Intelligence, and Virtual Reality.

Recently Tessolve has broadened the Japanese operations through the addition of highly skilled and experienced local Professionals in the progress and execution of business. Hitoshi Eda, Senior Manager, Program Management has joined Tessolve to act as a technical bridge between Japanese customers and the Tessolve engineering team. This expansion strategy will surely help Tessolve to differentiate its service offering and empower its team to engage with clients.

Tessolve Launches Edge Artificial Intelligence (AI) Integrator to build new Intelligent Solution

By | News/Press Releases | No Comments

Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, has announced a new Edge AI Integrator solution to transform customer’s connected products into new smart products and solutions.

The powerful combination of the Tessolve AI integrator and IoT offerings can support customers from various industries such as avionics, automotive, industrial and medical markets to build more intelligent solutions from their data.

Our Edge AI solution is the brain behind the IoT body parts to create new smart products and solutions or enhance existing products & services. 

The new edge AI integrator solution can be tailored to customer’s requirements and thus help organizations to augment innovation capabilities, increase working efficiency, improve cybersecurity, and enhance customer experience.

Tessolve is providing the advanced hardware and software capabilities, and the multi-standard connectivity required in the end-to-end IoT business solutions such as predictive maintenance for Industry 4.0, smart metering, enhanced vision systems & consumer products, asset management, …

If you want to find out more, please contact:

David Mudard

Senior Sales Manager – Embedded Systems
Tel: +33 (0) 428-290-800
Mobile: +33 (0) 637-303-732
Email: david.mudard@tessolve.com

Overview of VLSI – Physical Design capability

By | Brochure/Newsletter | No Comments

Motivated team, better design capability

Rich and extensive Physical Design (PD) experience has enabled the team to work on multiple successful tape-outs. Expertise with all Industry standard EDA tools, Design Flow and well trained to handle low power, high performance area critical designs.

In-house Tool for Performance Testing

By | Blogs, Thought leadership | No Comments

In the software development cycle, testing is one of the important criteria. There are many tools available in this space for testing such as Junit, Jmeter, manual, automation, and many performance testing tools.

Read More

Find out how Tessolve Software Testing services help you to establish a cost-effective software testing facility that delivers improved quality, reduces risks and time-to market.