Module 1

1. Orientation
2. Introduction to mixed signal ATE
3. DC instrument
4. Digital instrument
5. Debug Tools & Scan Test

Module 2

1. Waveform sourcing and capturing instrument’s concepts
2. Digital waveform sourcing, capturing and time measuring instrument
3. Digital signal processing and programming
4. Analog Waveform creation and capturing
5. DAC/ADC concepts and testing
6. Additional topics – (Flex operator interface, Data Analysis, PLL, Analog signal measurement)

Module 3

1. DIB design process and flow
2. PERL

Module 1

1. Orientation
2. Introduction to mixed signal ATE
3. DC instrument
4. Digital instrument
5. Debug Tools & Scan Test
6. Digital waveform sourcing, capturing and time measuring instrument.

Module 2

Module 1

1. Waveform sourcing and capturing instrument’s concepts
2. Digital signal processing and programming
3. Analog Waveform creation and capturing
4. DAC/ADC concepts and testing
5. Additional topics – (Flex operator interface, Data Analysis, PLL, Analog signal measurement)

*  Knowledge of Digital IC Testing is mandatory for joining the Mixed Signal IC testing course.

Module 1

1. Orientation
2. Introduction to IC fabrication technology
3. IC structure overview
4. Circuit Edit concept
5. Circuit Edit process flow

Module 2

1. Introduction to Decapping technique
2. Dual acid decapsulator system
3. Process recipe selection

Module 3

1. Introduction to FIB system
2. Application of FIB for VLSI Circuit Edit
3. CAD Navigation
4. Gas Assisted Enhanced(GAE) Etch
5. Sample preparation
6. Image contrast mechanism
7. Basics of beam induced sputtering and deposition

Module 4 (Micro surgery)

1. Cutting of metal lines
2. Making metal link
3. Via formation
4. Via filling by conductor
5. Probe pad construction
6. Challenges and constraints

Module 5 (Lab work)

1. Decapsulation of IC Packages
2. Basics of FIB imaging
3. CAD Navigation using KNIGHT software
4. Identification of FIB locations
5. Removal of passivation layers
6. Cutting of metal lines
7. Making metal links
8. Via formation to see buried metal layers
9. Via filling by conductor

Module 1

1. Introduction to Embedded Systems
2. Understanding of Real-Time Operating Systems (RTOS)
3. Basic circuit theory
4. Digital and analog design techniques

Module 2

1. C Language - C data structures

Module 3

1. 8051 Microcontroller Architecture and its peripherals
2. Assembly Language Programming and Embedded C Programming
3. Tools for preparing, debugging, translating programs, creating library files and hex files
4. Interfacing peripherals
5. Hands-on tutorials using 8051

Module 4

1. Introduction to Real Time Operating System and Embedded OS – pSOS overview,
2. IDE and Debugging tool
3. Network programming
4. File system manager, device management
5. Hands-on tutorials using pSOS

Module 5

1. Communication skills
2. Mock Interview sessions
3. Group Discussion
4. Seminars by Expert Professionals

Module 1

1. Introduction to Embedded Systems
2. Understanding of Real-Time Operating Systems (RTOS)
3. Embedded System Hardware
4. Introduction to communication Systems

Module 2

1. C Language- Data structures in C
2. Overview of wireless communication system current wireless technologies- GSM, WiFi, WiMAX, Bluetooth,
     ZigBee

Module 3

1. 8051 Microcontroller Architecture and its peripherals
2. Assembly Language Programming and Embedded C Programming
3. Optimized coding techniques for embedded systems
4. Tools for preparing, debugging, translating programs, creating library files and hex files
5. Short-range wireless communication
6. Hands-on tutorials using 8051

Module 4

1. Introduction to Real Time Operating System and Embedded OS- pSOS overview,
2. IDE and Debugging tool
3. Network programming
4. File system manager, device management
5. Design of a simple RTOS for embedded systems
6. Introduction to Wireless Sensor Networks
7. Hands-on tutorials and interfacing wireless transceivers with micro-controllers

Module 5

1. Communication skills
2. Mock Interview sessions
3. Group Discussion
4. Seminars by Expert Professionals