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Failure Analysis Activities

	The FA activities for Phase I:
Our Failure Analysis facility is probably the first of its kind in India. We are equipped with the following Features / Capabilities
A.	Focused Ion Beam ( F I B ) System
While the FIB and Decapsulation facilities have been commissioned and are available for use, the Phase II of the Lab Setup is expected to commence shortly.
	Features / capabilities:
	Well focused ion beam Laser guided stage movement Cutting of aluminum / copper metal lines Deposition of conductor High aspect ratio via formation Via filling by conductor Probe pad construction Probe pad isolation The FIB is dedicated for circuit edit application in sub micron semiconductor devices.
B.	De capping equipments
De capping of IC packages is pre requisite for many of FA tasks. In order to de capsulate different types of packages without causing damage to wire bond / solder ball, following equipments are being commissioned in the Tessolve FA Lab:
	Selective area polishing machine Dual acid de capsulation system Mechanical fixtures. While the FIB and Decapsulation facilities have been commissioned and are available for use, the Phase II of the Lab Setup is expected to commence shortly.
	In Phase II following equipments would be added to FA Lab :
	Scanning Electron Microscope ( S.E.M. ) Plasma Etcher Manual Wire Bonder Liquid Crystal analysis system Probe station