Increasing operating frequency and fast edge rates demands SI analysis on every designs. Tessolve - PCB Division’s engineers having expertise in using simulation tools to analyze the various factors which affects board performance like ringing, crosstalk, overshoot and undershoot detects the problems in the earlier stages and provide time and cost saving in addition to board performance.

Pre-layout analysis: To determine good stack-up and the effectiveness of critical component placement, critical signal paths and routing parameters.

Post layout analysis: To solve potential SI issues by changing the routing, termination schemes, optimized termination values and IO buffer selection.

Preroute   Analysis to  determine  the effectiveness of critical component  placement, critical signal paths, stackup and routing parameters.

Post layout analysis   to   solve potential   SI   issues by changing the routing, termination schemes, optimized termination values and IO  buffer selection.

Signal Integrity and Cross talk Analysis

• Reflection, Ringing, Overshoot/Undershoot, Multiple threshold crossing
• Forward and Backward Crosstalk
• Eye Diagram Analysis

 Power Integrity Analysis

• SSN analysis
• Power distribution system analysis
• De-coupling Capacitors Estimation

 EMI/EMC Analysis

• Study of EMI on board and Rectification
• EMC on FCC, CISPR, VCCI

Thermal Analysis

Hot Spot Analysis, Heat conduction, convention & radiation analysis, Finite volume, Finite element, Finite difference methods

• Reflection and Ringing Analysis
• Propagation delay variations (skew)
• Single/differential Crosstalk Analysis
• EMI Analysis
• Single-ended I/O supply noise (SSN) 
• Core Supply Noise & Analysis
• De-coupling Capacitors Estimation

• Parasitic RLC Extraction
• BIS and S-parameter Model
• Thermal Analysis-Theta Ja, Jb and Jc
• Thermal Model and Nodal Temperature

We have expertise in Chip to Package to board level simulations supported by in-house IBIS model development expertise.