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Chip Scale Package (CSP) is a package whose dimensions are no more than 20%
larger than the die or chip that it contains. Unlike DIP, SOJ, and TSOP
packaging, CSP packaging does not use pins to connect the chip to the board.
Instead, electrical connections to the board are through a Ball Grid Array
(BGA) on the underside of the package. ultraCSPTM is a chip scale package that
used an advance thin-film technology.
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