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Board Design Services

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Tessolve - PCB Division is certified DIN EN ISO 9001:2000 for HIGH SPEED PCB DESIGNING WITH SIGNAL INTEGRITY, CROSSTALK AND EMI/EMC ANALYSIS AND FOR PROVIDING TEST INTERFACE BOARD DESIGN SERVICES FOR ATE CHIP TESTING.

Today outsourcing of PCB design became a vital tool for business management which gives competitive cost and technology advantages. As a design house you may need additional resources frequently. Without having to invest yourself we will extend the resources for you. Higher clock speeds, faster switching and increasingly challenging density issues require a greater engineering input at the interface level if yields and output are to be maximized on the test floor. We understand how to design high-density, high-speed PCBs that are manufacturable and testable, meeting time-to-market and unit cost requirements.

Tessolve - PCB Division has been designing high quality printed circuit boards under different platforms to meet the varying customer’s requirements. Having expertise in analog, digital, radio frequency circuit board design, we are able to suggest a better solution for all your critical design issues within board constraints and design accordingly. We offer complete design service from schematic development to manufacturing data. Tessolve - PCB Division provides complete turnkey design solutions for board level design. Specializing in high speed design and layout technologies, we have developed boards for systems with data rates up to 40 Gbits/sec. Tessolve - PCB Division is serving as one of India’s leading fabless design companies for semiconductor industry. We work in proxy with client company’s designers to avoid design conflicts and to ensure 100% quality and error free work. Tessolve - PCB Division’s project managers coordinate and streamline the entire project from specification through production and test, as required by customers.

Services Offered
  • Design of high speed digital, analog and mixed-signal PC boards
  • Design of ATE chip test interface boards probe cards, load boards and DUT boards
  • Design of Burn-in test boards
  • Design of bench boards, Lab boards, Reference boards and evaluation boards
  • Design of HDI boards
  • Re-engineering of boards
  • Component footprint library development and maintenance
  • Signal Integrity, Crosstalk and EMI/EMC Analysis
  • High-speed Busses , Backplane and Interconnect modeling
  • Pre-layout and post-layout analysis
  • Thermal modeling and analysis
  • Mixed-domain signal Analysis for Gigabit Circuits
  • Mechanical and thermal stress analysis
  • PCB Cam , Manufacturing and Assembly services
Service Highlights
  • Extensive collection of well maintained footprint library compliance with IEEE, JEDEC and IPC standards
  • Exclusive engineering team for analysis and verification
  • Exclusive in house tool development team for process integration
  • Complete documentation packages
  • Interaction with in-house Signal Integrity experts
  • Interaction with the industry proven fabricators
  • IPC certified designers
  • Latest EDA tool platform for designing and Analysis
  • In house developed design tools for quality checking
  • Design reviews using web-conferencing
  • Quick turnaround time
  • Work round the clock towards meeting design deadline
  • Schedules based on targets
  • Manpower scaling on demand
  • Team work for designing
  • Skilled resources and experienced designers
  • Disciplined workforce for longtime relationship
  • Continuous training and education
  • Guaranteed customer satisfaction
  • Cost effective services with minimum lead time
  • Flexible business models
Service Benefits
  • Shortened product design life cycle
  • Reduces your design investment on manpower and infrastructure
  • Reduced product development cost
  • Support of experienced professional for complex designs
Technologies Exposed
  • PCI, PCI-Express
  • High speed USB
  • SPI-4
  • LVDS
  • Serial ATA
  • Rapid IO
  • High speed SERDES
  • DDR, DDR-II, QDR-SRAM
Serving Industry
  • ATE Industry
  • Consumer Electronics
  • Automotive
  • Industrial
PCB Design Capabilities
  • Design of complex Rigid, Rigid-flex, Metal core boards
  • Design of multi-layer PCB up to 40+ layers 
  • Design of board classes as per IPC / MIL STD
  • Design of boards with fine pitch technology
  • Design of boards with BGA, Micro BGA, Flex BGA, QFN
  • Design of boards with Blind and Buried via
  • Designing to the latest standards for DFM, DFT and ICT
  • Design of boards with sequential laminations
  • Design for ROHS compliance
  • Controlled impedance board design
  • Optimal board stack up with strip line, dual strip line stack ups for control impedance
  • Precision analog and mixed signal integration
  • Close coupling of Differential pair with edge coupling and broad side coupling
  • Skew matching as per the signal rise time
  • De-coupling techniques for powers
  • Micro via and Via less routing, constraint driven placement and routing, manual routing of critical traces.
  • Section wise Plane distribution for ground  and power for analog, digital and mixed signal designs
  • Design accordance with industry standards IPC-2221, -2222, -2223 and IPC-SM-782
  • Hands on experience in latest EDA tools

Schematic & Layout Level Analysis

  • Signal Integrity
  • Crosstalk and EMC analysis
  • Electromagnetic emission (EMI) issues.
  • Prelayout and post layout analysis

 

Quality Policy

Tessolve - PCB Division is committed to provide solutions of the highest quality to semiconductor industry with enhanced customer satisfaction.

We strive to improve our services continually by implementing and maintaining effective Quality Management System through well-planned approach in all processes, Timely delivery with dedicated professionals.

Business Model

  • Our Business model is very simple and straight forward.
  • Quoting on Project/Hr Basis
  • Retainership basis.