Tessolve is a leading integrated circuit test engineering solution provider for logic, RF, analog, power, mixed-signal and memory technologies supporting wireless, Broadband, network/fiber optics, analog and high end mixed signal consumer markets. Tessolve offers its services to semiconductor companies and known for its technical excellence and operational expertise, providing its customers with best in class test services. Our test floor versatility, continuous enhancement and fast adaptation of test technology results in time and cost reduction and improving overall productivity.

Tessolve invested in most recent testers and test equipments to meet the growing complexity in device test requirements. We engage our experienced test consultants from the preliminary stages of your product development cycle to final finishing stage of successful tape out. Our involvement in your device development cycle reduces your burden, time and cost. Our complete test engineering team's capability and the test floor facilities solves mixed signal, analog and RF test requirements.

We deliver incomparable test solutions to integrated circuits device developers separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices.

Tessolve is probably the only independent company with 400 plus test engineering resources offering total solutions  for chip test engineering. It also has a good portfolio of Automatic Test Equipment (ATE) to cover various device requirements like RF, High Speed Digital and Analog. 

Tessolve is not affiliated to any ATE company and therefore ensures customer objectives of lowest cost of test and maximum test coverage, met by choosing the most optimal test systems. Its independence from sub-cons permits it to transfer ownership of all IP and hardware to the end customer giving them the freedom to choose the most optimal and best performing sub-con for production ramp up.

The company has following ATEs available in-house with trained personnel to operate them:

• Agilent 93000 SOC Series Pin Scale: High speed Digital & Mixed Signal Test – LTH & CTH
• Teradyne Catalyst: Digital & Mixed Signal Test
• Teradyne Flex: Digital & RF
• Teradyne A575: Mixed Signal
• LTX Fusion HF: Mixed Signal
• Credence 3000 RF: RF & Mixed Signal
• Credence Duo: Digital & Mixed Signal

Our Test Engineering Division offers the following services

• Test Plan Development  
• Vector Conversion 
• Test Program Development 
• Test Hardware Development
• Device Debug
• Characterization
• Temperature
• Voltage
• Wafer sort program development & Debug
• ATE to Bench Correlation
• ESD, Latch up
• Multi-site / Low cost platform conversion
• Optimization & Sub-con Release
• T&M based Engineering Service
• Our Test Engineers can be used to service your additional requirements

Expertise

Tessolve Development Center (TDC) specializes in mixed-signal, memory, high-end digital and RF products including: 

• High Performance ASIC and ASSP devices
• System-on-Chip (SOC) or System-in-Package (SiP) devices
• Disk Drive and Mass Storage devices
• RF devices – WiMax 802.11, 802.16
• Telecommunication and Networking devices
• Multimedia Processors and Graphic engines
• Mobile RAM devices with SDRAM and DDR DRAM
• CIS and CCD controllers within PSRAM (Pseudo SRAM ) and Flash
• CDMA chipsets with embedded lower density memory
• High resolution and high speed converters (Audio/Video ADCs & DACs)
• SERDES
• SATA & USB 2.0

Tessolve in your product development cycle

Involving Tessolve in your product development cycle helps in the following ways: 

• You maintain your core-competency by focusing on product design
• Test resources available when you need them for as long as you need them
• Experienced pool of Test  and  test  hardware  design resources
• Minimized cost of test through incorporation of test features in design
• Benefit by understanding the requisite test related features that need to be incorporated in design  

Advantages

• Fixed price contracts to enable better cost control  
• Knowledge of Sub-con capabilities & release procedures / requirements
• All software & hardware delivered are owned by the customer 
• Ability to ramp up resources to meet pressing schedules
• Engineering cost advantages

Our Business  Model

Tessolve can work with customers to come up with solutions that best fit the individual needs. Customers are free to choose from among the following scenarios 

• Rent Tessolve testers but use their own test engineers for test development
• Have Tessolve engineers work at customer sites for test/product engineering or lab characterization work
• Consign customer owned testers to be placed at Tessolve site
• Use Tessolve’s expertise & Infrastructure for specific jobs in FA, DFT, Test engineering, Assembly
• Run smaller Production volumes
• Partnership model
• Have Tessolve do the full turnkey test development including  designing of  test hardwares
• Design and development of Advanced Wireless Solutions on a turn-key basis
• Develop customized solutions in the Wireless Sensor Networking Space