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Tessolve is a leading IC test house offers 'one-stop' test solution from Test
engineering to test hardware for mixed signal, RF and wireless communications
applications. Get your devices test and certified "good" at our test floor by
our expert IC test consultants
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| Tessolve offers Design for testability services (DFT) to
facilitate incorporation of appropriate test features into your design. The
engineering team is capable of taking RTL or Netlist through all stages of DFT
using Mentor or Synopsys tools. |
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Tessolve's VLSI edit capabilities can reduce your device development cost and
cycle time. We have the art of equipment to do micro surgery on a chip using
focussed ION beam (FIB) for design debug. |
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Tessolve provides IC packaging design and assembly services through its
association with external vendors. Our in-house design and SI analysis team
solves and suggest solutions for your package related issues. |
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Tessolve as a turnkey test solution provider takes care of your test hardware
requirement including test boards, stiffeners and sockets. We have the in-house
capability to build the probecards, loadboards and handler interface boards. |
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| We provide turnkey Printed Circuit Board (PCB) services from
design, manufacturing and assembly. Our experienced high speed design group
address your board related issues effectively and produce world class quality.
Also Our Signal and thermal analysis capabilities enables us to deliver the
right design at the first time. |
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Tessolve's characterization lab is equipped to offer high frequency package
characterization services. We have trained resources for development of test
plan test & sequences for high speed digital and RF device
characterization. |
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