Tessolve is equipped with the most advanced, fully loaded Automatic Test Equipment (ATE) for testing and evaluating mixed and RF signal devices.

Test Platforms

Tessolve has invested in testers and tester options that support a full range of test requirements. It’s leadership in high-end, mixed-signal test can significantly reduce the customer’s engineering burden. Its comprehensive test platform portfolio provides extensive options in platform availability and instrumentation capability required for mixed-signal, RF and digital testing.

• Agilent 93000 SOC Series Pin Scale: High speed Digital & Mixed Signal Test – LTH & CTH
• Teradyne Catalyst: Digital & Mixed Signal Test
• Teradyne Flex: Digital & RF
• Teradyne A575: Mixed Signal
• LTX Fusion HF: Mixed Signal
• Credence 3000 RF: RF & Mixed Signal
• Credence Duo: Digital & Mixed Signal

Services

Tessolve is capable of providing a turnkey solution to all its clients. This includes services mentioned here below:

• Test Development - Tessolve has developed a pool of dedicated test engineers with years of experience in the field of test engineering. While most of the senior engineers have relocated from abroad, Tessolve has built an able team of junior engineers using its exhaustive in-house training programs.

  The company has its engineers specialized in various device types like mixed-signal, memory, high-end digital and RF. These professionals are ready to be deployed worldwide in support of customer programs.

  Tessolve has a proven track record in delivering high quality test programs in a timely manner. It offers both full service and limited test engineering support, based on specific requirements. These services can be customized to give customers the requisite resources, at the right time and cost.

  Today the company has strength of  400+  Engineers. As part of test development, the company offers the following:

  • Test Program Development / Test Vector Conversion: Tessolve undertakes complete test program development after the conversions of the vectors into ATE acceptable formats. It prepares the test program which is later optimized to meet the test time estimates of the client.
  • Test Hardware: The company offers turnkey solutions wherein it undertakes to design, fabricate and assemble all necessary test hardware. This includes loadboards, sockets, probe cards, adaptor boards, change kits, burn-in boards etc.
  • Device Debug: As part of its turnkey offering, the company engages in debugging the various revisions of silicon to validate its functionality.
  • Characterization: In its characterization phase, the device is tested at various temperature and voltage corners to understand its performance under extreme conditions.
  • Conversion: As part of the test program development, Tessolve also provides the following services: 
    • Multisite Conversion: Converting an existing test program to a multisite program. This is an ideal offering for companies seeking to ramp up to production testing of higher volumes.
    • Porting to alternative platforms: Tessolve has tremendous experience in converting existing test programs to other platforms, for reasons of cost benefits, ATE obsolescence, ATE availability etc.
• Design for Test (DFT): A service offered to Silicon design houses, which involves addition of DFT hooks / structures (insertion of SCAN, BIST), verification of DFT, ATPG vector generation using standard EDA tools.
  • DFT – Specification
  • DFT – Insertion and Validation
  • Test Vector Generation – to ensure test time and dppm is within the targets.
• Wafer Sort: Tessolve has an in-house 8” prober using which it can carry out wafer sort operations. This also enables the company in the development of wafer sort programs for release at other locations.
• Failure and Reliability Analysis: The FA lab is currently equipped with a De-cap machine and a high-end FIB Machine (capable of dual site edits).
  • As on date, we provide Reliability services using third party vendors. These services will be provided in-house in due course.
• Production Screening & Testing: Tessolve currently offers production testing services on available platforms. This offering is greatly advantageous to clients who have volumes that are not supported by subcons. For larger volumes, Tessolve can undertake to coordinate the activity at various subcons. Herein, Tessolve will undertake yield management & analysis, cost control, and time schedules.
• Assembly: Tessolve provides Package selection consultation and undertakes requirements for a wide variety of packaging. This service is offered using third party vendors who specialize in the field. Tessolve will offer the service in-house in due course.
• Rental: All ATE equipment at Tessolve is available on an hourly rental basis to customers who have in-house engineering capabilities.
• Training: Tessolve is capable of providing training services on a wide range subjects from Test Methodology, Digital Test Concepts and also Tester Platform specific training. We are certified by Teradyne to provide Advanced Catalyst programming classes in India.
• Maintenance: Tessolve has developed a team of experienced maintenance engineers. While these engineers maintain all in-house equipment, their services are also availed off by our clients who require their expertise. This expertise exists in maintenance of ATE’s, Handlers and Probers.
• Advanced Wireless Solutions Division (AWSD): Tessolve has forayed into Wireless Sensor Network (WSN) products and solutions. We offer a complete range of WSN (ZigBee today with W-HART and UWB planned for the future) solutions from a range of Products (branded WiSens®), tools, test solutions and services including inter operability and pre-certification test services.
• Turnkey Printed Circuit Board design Fab and assembly services: Tessolve offer turnkey PCB solutions to the global electronics industry. In addition to fab and assembly, our specialized skills in RF and mixed signals board designing combined with Signal Integrity and thermal analysis add values to customers looking for one stop solutions for their PCB requirements. We take the total accountability for the complete board development cycle from schematic development to delivering the tested assembled boards with the required approvals.
  • Signal Integrity(SI) & Thermal analysis: Tessolve extends its services by offereing board and package level signal and thermal analysis to deliver the right design at first time .
  • IC Package design and Assembly Services: Tessolve offers expert Consulting on package selection, design and assembly requirements with a team experienced engineers

Expertise

Tessolve Development Center (TDC) specializes in mixed-signal, memory, high-end digital and RF products including:

• High Performance ASIC and ASSP devices
• System-on-Chip (SOC) or System-in-Package (SiP) devices
• Disk Drive and Mass Storage devices
• RF devices – WiMax 802.11, 802.16
• Telecommunication and Networking devices
• Multimedia Processors and Graphic engines
• Mobile RAM devices with SDRAM and DDR DRAM
• CIS and CCD controllers within PSRAM (Pseudo SRAM ) and Flash
• CDMA chipsets with embedded lower density memory
• High resolution and high speed converters (Audio/Video ADCs & DACs)
• SERDES
• SATA & USB 2.0

Tessolve also offers a wide range of test options capable of handling all kinds of test features including SCAN, JTAG, BIST and device types with high pin-count, high speed, large vector memories and a large number of time sets.

Using its experienced engineers, Tessolve can provide the superior level of engineering support required by a very large range of devices.

Advantages for Engaging Tessolve

Involving Tessolve in your product development cycle helps in the following ways:

• You maintain your core-competency by focusing on product design
• Test resources available as long as you need them
• Experienced pool of Test resources
• Minimized cost of test through incorporation of test features in design
• Benefit by understanding the requisite test related features that need to be incorporated in the design