P. Raja Manickam – Founder

Founded Tessolve in 2003 with a dream of creating a productization company from physical silicon to high volume manufacturing; his work experience in product companies, fabless companies in Silicon Valley and high volume factories in Singapore, Malaysia and Japan is a unique combination to succeed in New Product Introduction cycle.

He started his career in Texas Instruments as a test engineer and later with Fairchild, National Semiconductor. He was with DTS and Viko test labs and was involved in the early start up of STATS and UTAC.

Has held engineering, product line, sales and marketing responsibilities in his 27 year career. Alumni of IIT Kgp in ECE.

Veerappan V. – Co-Founder & VP – Operations

Co-founder & VP-Operations of Tessolve, Veerappan brings with him 25 years of varied experience in companies like Sterling Electronics – a pioneer in the Indian electronics industry. He was then with DCM Data Products as a Territory Manager; before handling national level sales and customer support operations with Wipro Technologies. Veerappan then moved on to Motorola as GM – Operations in-charge of MIS, Facilities, HR, Admin, PR, Systems and Commercial. He had a brief stint as Head of Operations & Business Development of BPL Telecom before Tessolve.

Srinivas Chinamilli – Co-Founder & VP – Engineering

Srinivas has more than 17 years of experience in semiconductor Test and Product engineering. He has held management and technical positions at Cirrus Logic and was the Director of Worldwide Test engineering at Centillium Communications prior to joining Tessolve. He has extensive experience in the area of Mixed Signal and System on Chip test development, high volume production test and offshore test subcontractor management.

He has received his B.E. (Electrical and Electronics) from Birla Institute of Technology and M.S. in Electrical engineering from University of Southern California.

Ram Satagopan – Vice President - AWSD

Ram heads the Advanced Wireless Solutions Division of Tessolve. He has over 21 years of engineering, entrepreneurial, product and business management experience in the embedded wireless telecom industry. Prior Tessolve, Ram had founded and run a multinational technology business that specialized in building Wireless Sensor Network products and before that, held senior technical and management positions at Motorola building advanced wireless technology products. Ram has several utility and design patents awarded and defensive publications in real-time embedded consumer electronics system design and software. Ram has a Bachelor’s degree in Electronics from India and a Master’s in Management of Technology from Graduate School of Business, National University of Singapore.

Desi Judilla – Vice President, Sales and Marketing

Desi has more than 19 years experience in the area of semiconductor manufacturing, sales and business development. Prior to joining Tessolve, Desi worked for United Test and Assembly Corporation (UTAC) as Senior Director of Sales. Desi has also held various sales, marketing and technical positions at ST Assembly Test Services Inc. (STATS), Total Test Services Inc., LTX Corporation and Hines and Associates Inc.

Desi holds an Associate’s Degree in Electronic Technology for Bay Valley Technical Institute, a Bachelors degree in Business Management from the University of Phoenix and a Masters in Business Administration from Saint Mary’s College of California.

S.L.N.Murthy - Chief Technology Officer

Murthy has a postgraduate degree in Electronics from Indian Institute of Science and worked as a member of R&D team Bharat Electronics responsible for setting up of large CAE design center. He has provided specialized CAD and CAE services of Printed Circuit Boards to Indian Space Research Organization and Defense R&D Laboratories .Later he Promoted ECAD Technologies to focus on design engineering and analysis with special reference to Printed Circuit Boards design and engineering in 1995.AT&S the #1 PCB manufacture of Europe acquired ECAD Technologies and in August 2005. He pioneered the cause of “Analyze Before Build” concept by propagating design analysis with focus on PCB in many forums of the industry. Also he Has been involved as a faculty in conducting the Microelectronics packaging Course at Indian Institute of Science as part of Continuing Education program in association with IEEE CPMT Society. As a Visiting faculty at Indian Institute of Science on electronic packaging, he Has participated in many international and national CAD CAM seminars/workshops and presented lectures/papers. He is a lifetime member of societies like IEEE, IEEE EMC Society, CSI and IMAPS.

Yogan Senthilkumar – Director – Engineering

Yogan is the Director of Test Engineering at Tessolve and heads the Tessolve Application Development Center and Training Division. He has behind him 20 years of experience in the semiconductor test industry. Before joining Tessolve, Yogan was with Teradyne Asia, handling test engineering projects from Teradyne US and Europe. His experience includes providing turn key solution for various Converters, GPS, Bluetooth, WiFi and WiMax  technologies. Yogan’s earlier years were with Salland Engineering, National Semiconductor and SPEL where he was involved in test engineering, programming, and trouble shooting. He has presented papers on Test technique at various conferences including the TUG, Semicon etc…

Raj Chidambaram – Director – Package Engineering and R&D

Raj has a Masters in Engineering Mechanics from the University of Arizona. As the Director of Packaging Engineering and R&D he brings to Tessolve a total of 16 years of engineering expertise with companies like Intersil, Maxim, ASAT, Cypress and SPIL. Raj’s expertise pertains to Package design & development, managing of engineering issues at subcontractor locations. He has through his illustrious career been involved in various package & assembly related functions including thermal & stress analysis, evaluation of new materials and Package model generation.

Nathan – Director - Test Operations 

Nathan has a total of nearly 33 yrs of working experience of which 25 years has been in the semiconductor and semiconductor related fields. Prior to joining Tessolve he worked at National Semiconductor, Singapore as Equipment Engineering Manager. Manufacturing, Test/Back-end Process, Equipment Engineering etc are his fields of expertise.

Sundararajan – Director (Sales & Marketing)

Sundararajan is a Graduate in Electronics & Communication Engineering and has 19 years of total experience in Project Engineering and Sales & Marketing. Has 14 years of focused experience in sales & marketing in EDA / CAE software solutions and Engineering Services with Future Techno Designs and AT&S ECAD. Prior to Tessolve, he was with AT&S ECAD as Vice President (Business Operations), heading a sales & support team involved in Business Development activities of the PCB Engineering Services and Software solutions the company was providing. As one of the key management member at AT&S ECAD, also responsible for Business operations & strategic initiatives for the organisation’s growth.
 

Anand Muthaiah -Director  - Test Enginering

Anand is a graduate from BIT ,Bangalore and did his masters at University of South Florida, majored in Solar Cell Manufacturing Technology. He moved to VLSI and work in Product/Test and design Engineering at Cyrix, National Semiconductor.and later moved to Tester applications at LTX corporation.He has extensive knowledge in Digital test, hardware design and volume production.

Chandra Sekhar G. – Senior Manager- DFT

Chandra Sekhar heads the DFT division as Senior Manager. He holds bachelors degree in Electronics & communication, Chandra brings to Tessolve 10 years of experience with companies like Wipro, Exanet. He has proven experience in DFT, Test automation, RTL design and Verification. Chandra has taken several chips from specification to production in stringent timelines.