Tessolve offers digital, mixed signal, wireless and RF device test program development and implementation of test solutions from prototype characterization to full production in Industry standard ATE Machines. Tessolve has the complete skill test to test radio frequency (RF) components, ICs and modules. We have different range of testers which gives the customers the flexibility of choosing a cost effective solution. Beyond IC Test services, We also have in-house design, fab and assembly expertise to build test interface boards for testing and debugging of system level functionalities of new IC devices. We have a FIB and De-Cap systems for failure analysis and circuit edit, thus we eliminate employing multiple vendors to get your device tested. Tessolve is the place where our engineers excel in identifying and solving numerous real world IC test challenges in unique ways. We have highly intelligent, inspired people working passionately with creativity to provide optimal solutions to our clients. We provide best environment to learn and experiment to collaborate with clients chip test challenges. By continuously improving our RF, mixed signal test techniques, we stay at the forefront of test technologies. As a result, we deliver high performance test solution at competitive cost with highest quality.

• Test Floor Facilities
  • 50,000 sq feet building
  • Chilled Water, Compressed air, Vacuum, anti-static flooring
• Testers
  • Verigy Pinscale (93000)
  • Teradyne Flex
  • Teradyne Catalyst
  • Teradyne A575
  • Credence ASL3000RF
  • Credence Duo
  • LTX Fusion
• Thermo stream
• Tel P8 Prober, Synax handler
• FIB machine (Micrion)
• De-encapsulation machine – Dual acid
• Bake, Drypack, strapping machines